2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) 2015
DOI: 10.1109/eptc.2015.7412330
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Breakthrough development of new die attach method with high conductive wafer back coating

C. E. Tan
1
,
Kanamori Naoya2,
Y. S. Lee
3
et al.
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Die-Attach Materials for Extreme Conditions and Harsh Environments

Shen
1
,
Fanini
2
2019
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
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Die-Attach Materials for Extreme Conditions and Harsh Environments

Shen
1
,
Fanini
2
2019
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
1
0
1
0
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Hybrid Sintering Glue and Stencil Printing Process: New Generation Die Attach Method for Quad Flat No Leads Package

Bacquian
1
2019
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
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Design and characterization of thermal conductive wafer coating in thin small outline package for automotive product application

Hamid
1
,
Periathamby
2
,
Azizan
3
et al. 2016
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) &Amp; 18th Electronics Materials and Packaging (EMAP)
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