IEEE Trans. Electromagn. Compat.
 2020
DOI: 10.1109/temc.2018.2888691
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Bringing the SEED Approach to the Next Level: Generating IC Models for System ESD and Electrical Stress Simulation out of Design Data

Michael Ammer
1
,
Yiqun Cao
2
,
Andreas Rupp
3
et al.
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Cited by 7 publications
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References 11 publications
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Improvement of SPICE based ESD Protection Models for I/O Protection Modeling

Pak
1
,
Mousavi
2
,
Pommerenke
3
et al. 2021
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
4
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Improvement of SPICE based ESD Protection Models for I/O Protection Modeling

Pak
1
,
Mousavi
2
,
Pommerenke
3
et al. 2021
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
4
0
0
0
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IC-based Antenna Switch Modeling and Robustness Evaluation for SEED Applications

Mousavi
1
,
Fellner
2
,
Pommerenke
3
et al. 2021
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium
1
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ESD Behavior of RF Switches and Importance of System Efficient ESD Design

Mousavi,
Tauber,
Pak
et al. 2023
2023 IEEE Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMC+SIPI)
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