“…The SIW based structures can be implemented by various manufacturing processes such as conventional printed circuit board process (PCB) [8,9], multilayer PCB process [10], photoimageable thick film technology [11], and low-temperature cofired ceramic (LTCC) technique. There are many techniques to improve the gain, either by using large arrays [12,13], which in turn increases losses from the feed network especially at the high frequencies, or by using superstrates [14,15]. This technique is simple and efficient to improve the gain.…”