We present a theoretical and experimental study of L-band (1-2 GHz) Lamb mode resonators in Gallium Nitride (GaN) monolithic microwave IC technology. These resonators leverage Au-free metallization and optimized anchors, enabling f·Q products up to 5.5×10 12 , the highest reported in GaN resonators to date. These devices also demonstrate the highest electromechanical coupling (keff 2 of 0.39%) measured in GaN resonators using an interdigitated transducer in the absence of a bottom electrode. Achieving such high values of f·Q and keff 2 , these GaN MEMS resonators can enable channel select filters for wireless communications, with wide bandwidth tuning capabilities (0.18 -0.8 MHz ) at 1-2 GHz range.Keywords-gallium nitride, III-V, piezoelectricity, MEMS resonators, Lamb mode resonator.
I.MOTIVATION Over the past few years, the transition to third and fourth generation (3G, 4G) wireless communications has led to an increase in demand for higher bandwidth wireless data transfer with unprecedented frequency selectivity. As a result, telecommunications systems such as Global System for Mobile (GSM) or Code Division Multiple Access (CDMA) have been partially replaced by networks that allow higher data transfer rates and multiple users per band. One such technology is the Long Term Evolution (LTE) system [1], characterized by broadband data transfer through multiple narrow bandwidth subcarriers. Multiple LTE frequency bands have been released in the ultra-high-frequency range. In order to achieve cost-efficient data transfer rates, these LTE radio access networks can benefit from efficient hardware, including both front-end filters and reliable frequency sources for clocking. With quality factors exceeding 5,000 at GHz frequencies, small footprints, and the ability to achieve multiple frequencies on the same chip, MEMS resonators can provide solutions for low loss narrow bandwidth filters and low phase-noise oscillators for operation over a wide frequency range.MEMS resonators also have the capacity for monolithic integration with standard integrated circuits, which has the benefit of reduced size, weight, and power, improved parasitics, and reduced impedance matching constraints, particularly at high frequencies. A lot of effort has gone into CMOS integration of MEMS resonators [2,3]. However, for high power, high frequency applications, III-V monolithic microwave ICs (MMICs) are increasingly dominating the market. As a wide bandgap semiconductor, GaN provides high electron velocities, charge densities (1×10 13 cm -2 in AlGaN/GaN), and critical electric fields, ideal for high power (>10W/mm), high frequency (>300 GHz) ICs. GaN also exhibits high piezoelectric coefficients (electromechanical coupling keff 2 up to 2% in FBARs) while at the same time having high acoustic velocities and low acoustic losses.The authors have previously demonstrated high performance passive and active (HEMT-sensed) GaN resonators from 200 MHz to 3.5 GHz in both flexural and contour modes [4]. Successful implementation of MEMS resonators for c...