Broadband Split Ring Resonator-Based Antennas at 140 GHz in Embedded Wafer Level Ball Grid Array Technology

Bekker, Elizabeth; Bhutani, Akanksha; Oliveira, Lucas Giroto de; Antes, Theresa; Zwick, Thomas

doi:10.1109/iwat54881.2022.9811051

Cited by 4 publications

(3 citation statements)

References 14 publications

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“…For eWLB AiP solutions, the ground (GND) metallization on the PCB acts as a reflector for the electrical field. In this setup, different antenna structures in the 77 GHz and 140 GHz frequency range, such as dipoles, patch, vivaldi, or splitring resonator-based antennas are demonstrated [21], [36]- [38]. Moreover, vertical interconnects for stacked packageon-package (PoP) system applications are shown [22].…”

Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 98%

“…Second, it also eliminates the complex assembly technology required to mount the IC on the PCB and connect it to the off-chip antenna substrate [13]. Third, the integration of the entire system in the eWLB package eliminates the need for an RF-compatible substrate for low-loss power transfer from the IC to the antenna, thereby reducing manufacturing complexity and cost, and in particular avoiding the disadvantages of LTCC structures in terms of shrinkage and layer displacement [2], [13], [35], [36]. Therefore, WLB eliminates three cost drivers in system application design.…”

Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 99%

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

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This paper presents a broadband low-loss fanin wafer level ball grid array (WLB) vertical through-moldvia (TMV) interconnect that enables highly integrated systemin-package (SiP) applications beyond 220 GHz. The dedicate advantage of the proposed approach is to further minimize the separation between package components (e.g., antenna in package (AiP)) and on-chip receiver or transmitter chain. To demonstrate the robustness of the TMV interconnect design, the necessity for co-simulation of the integrated circuit (IC) package and the IC itself during the package-design is shown. Therefore, an in-depth analysis of the suppression of parasitic mode oscillation inside silicon is carried out. Furthermore, the parasitic radiation loss at the TMV interconnect discontinuity is given and a verification of the proposed TMV due to high agreement of simulation and measurement results is demonstrated. The interconnect has been verified with a measured 10 dB return loss bandwidth of 38 GHz and a de-embedded insertion loss of less than 2.8 dB at 275 GHz, which enables a compact low-loss broadband signal transition from active IC components in the backend-of-line (BEOL) to passive components in package. Compared to fan-out WLB, the developed fanin WLB solution enables higher integration density of active and passive components with the shortest interconnects for minimal insertion loss. Thus, the proposed fan-in TMV packaging provides a very compact, easy-to-assemble and cost-efficient alternative for SiP designs for future broadband communication and sensing solutions.

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Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 98%

Section: A State Of the Art Wafer Level Packagingmentioning

confidence: 99%

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

Preprint

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show abstract

“…Regarding wideband antennas centered around 140 GHz, a single-ended corner patch element from [11] and results for a dipole, bow-tie, and rhombic differential antenna [12] have been published. The round SRR antenna from [13] and the differential, square SRR (SSRR) antenna from [14] are significant contributions in this area. The SSRR had the highest gain, for a single antenna element, in eWLB packaging technology, above 100 GHz, to date.…”

Section: Aip In Ewlbmentioning

confidence: 99%

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

Bekker,

Gramlich,

Valenziano

et al. 2024

Int. J. Microw. Wireless Technol.

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A system-in-package for a wideband digital radar, in D-band, requires broadband, high-gain antennas combined with broadband chip-to-package and package-to-printed circuit board (PCB) interconnects. This paper demonstrates a wideband, low-loss quasi-coaxial signal transition, and a novel electric split ring resonator (eSRR)-based antenna-in-package (AiP) with a modified reflector concept, for improved gain, in embedded wafer level ball grid array (eWLB) technology. A complete chip-to-package-to-PCB interconnect is also demonstrated by combining the quasi-coaxial transition with a chip-to-package interconnect. The quasi-coaxial signal transition has the largest impedance bandwidth among ball grid array-based quasi-coaxial signal transitions. For the modified reflector concept, a horn-shaped cavity is micromachined in the PCB substrate and remetallized with aerosol-jet printing, placing the reflector 0.25λ from the antenna. The antenna gain is improved with up to 5.3 dB. The AiP with the horn-shaped reflector is the single element with the highest gain, in eWLB technology, above 100 GHz.

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Pfahler,

Breun,

Engel

et al. 2024

IEEE Trans. Compon., Packag. Manufact. Technol.

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Broadband Split Ring Resonator-Based Antennas at 140 GHz in Embedded Wafer Level Ball Grid Array Technology

Cited by 4 publications

References 14 publications

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

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