1988
DOI: 10.1143/jjap.27.l2364
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Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment

Abstract: We investigated Se structures of different degrees of disorder ranging from a 5% up to a 95% degree of amorphization. Starting from a trigonal crystalline structure we applied different strategies to introduce disorder into the Se configurations by irradiating atoms from their crystalline equilibrium positions. According to the symmetry of the trigonal phase, we introduced three types of disorder, i.e. the first type where only atoms forming layers of complete helical chains are shifted from their original pos… Show more

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Cited by 114 publications
(44 citation statements)
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References 33 publications
(30 reference statements)
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“…Also, protrusions from the surface (resulting from previous processing) of greater than 10Å can produce problems in the bonding. All of the process steps are conducted in a cleanroom environment, although Gösele has proposed a powerful "microcleanroom" concept that does not require a cleanroom [25]. The surface-preparation step involves cleaning the mirror-smooth, flat surfaces of two wafers to form a hydrated surface.…”
Section: B Silicon Bonding Processmentioning
confidence: 99%
“…Also, protrusions from the surface (resulting from previous processing) of greater than 10Å can produce problems in the bonding. All of the process steps are conducted in a cleanroom environment, although Gösele has proposed a powerful "microcleanroom" concept that does not require a cleanroom [25]. The surface-preparation step involves cleaning the mirror-smooth, flat surfaces of two wafers to form a hydrated surface.…”
Section: B Silicon Bonding Processmentioning
confidence: 99%
“…A clean environment is critical in this step, as a dust particle of ∼ 1 µm in size can lead to a bubble at the bonded interface of ∼ 1 mm [26]. Portable clean room setups (not explored in this work) have been proposed to control this effect [27].…”
Section: B Silicon Direct Bondingmentioning
confidence: 99%
“…Thirty seconds O 2 plasma results in a thin layer of highly active native oxide on both SOI and III-V surfaces. The two wafers are then DI rinsed and spin-dried in a modified microcleanroom [35]. The DI rinse knocks off the newly attached surface particles during O 2 plasma treatment, and also serves as the last activation step to passivate both surface with a high density of hydroxyl groups (-OH).…”
Section: Wafer-scale Integrationmentioning
confidence: 99%