2017
DOI: 10.1016/j.solmat.2017.03.019
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Bulk defect formation under light soaking in seed-end n-type Czochralski silicon wafers – Effect on silicon heterojunction solar cells

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Cited by 8 publications
(2 citation statements)
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“…In addition, n‐type Cz wafers can also suffer from LID, as reported by Letty et al for seed‐end wafers. [ 51 ] N‐type Cz wafers are also susceptible to reductions in lifetime due to thermal donors. [ 52 ] Thermal donors are recombination‐active defects thought to be formed via the aggregation of silicon and interstitial oxygen atoms.…”
Section: Defect Engineering Approachesmentioning
confidence: 99%
“…In addition, n‐type Cz wafers can also suffer from LID, as reported by Letty et al for seed‐end wafers. [ 51 ] N‐type Cz wafers are also susceptible to reductions in lifetime due to thermal donors. [ 52 ] Thermal donors are recombination‐active defects thought to be formed via the aggregation of silicon and interstitial oxygen atoms.…”
Section: Defect Engineering Approachesmentioning
confidence: 99%
“…Phosphorus also has a smaller segregation coefficient (0.35) [55,56] than that of boron, leading to larger variations in the bulk doping throughout the ingot. More recently, other LID effects have also been observed in the seed-end of n-type Cz ingots that can reduce performance by 10% relative [64].…”
Section: Decreasing the Boron Doping Concentrationmentioning
confidence: 99%