2015
DOI: 10.1080/22243682.2014.977821
|View full text |Cite
|
Sign up to set email alerts
|

Bulk heterojunction organic solar cells fabricated using the push coating technique

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

0
7
0

Year Published

2017
2017
2021
2021

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 7 publications
(7 citation statements)
references
References 29 publications
0
7
0
Order By: Relevance
“…Recently, a second attempt to use push-coating for electronic device fabrication resulted in the generation of PSCs with PCEs up to 2.65% (as compared to 3.94% for the reference spin-coated devices). 29 These promising results obtained by using extremely thin single layer PDMS stamps demonstrated that push-coating can be applied not only to OFET fabrication but also to PSCs. However, the push-coated devices displayed much lower device performances compared to those of the spin-coated reference devices and the reproducibility of the photovoltaic performances was rather low with the necessity to use weights on top of the stamps during the process (decreased control over the process).…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Recently, a second attempt to use push-coating for electronic device fabrication resulted in the generation of PSCs with PCEs up to 2.65% (as compared to 3.94% for the reference spin-coated devices). 29 These promising results obtained by using extremely thin single layer PDMS stamps demonstrated that push-coating can be applied not only to OFET fabrication but also to PSCs. However, the push-coated devices displayed much lower device performances compared to those of the spin-coated reference devices and the reproducibility of the photovoltaic performances was rather low with the necessity to use weights on top of the stamps during the process (decreased control over the process).…”
Section: Introductionmentioning
confidence: 99%
“…The combination of these two phenomena provides us with the possibility to form films with higher crystallinitiy degrees at much lower temperatures. Recently, a second attempt to use push-coating for electronic device fabrication resulted in the generation of PSCs with PCEs up to 2.65% (as compared to 3.94% for the reference spin-coated devices) . These promising results obtained by using extremely thin single layer PDMS stamps demonstrated that push-coating can be applied not only to OFET fabrication but also to PSCs.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, both these strategies are based on spin-coated (SC) thin films, and thus a large amount of costly active material and solvent is discarded during the deposition process. Unlike spin-coating or other common deposition techniques, push-coating produces high-quality conjugated thin films on a given area without generating any material loss. This relatively unexplored process consists in placing a polydimethylsiloxane (PDMS) film on a small amount of active solution dropped on a substrate. The solution then instantly spreads through capillary forces between the substrate and PDMS, thus producing uniform wet films.…”
Section: Introductionmentioning
confidence: 99%
“…After the solvent diffuses into PDMS, a uniform conjugated polymer (or blend) dry film is formed while the small amount of solvent is temporarily trapped inside PDMS and can be easily recycled (Figure ). Although P3HT-based active layers have been successfully formed by push-coating to produce PSCs with similar PCEs as SC ones, the performances of push-coated (PC) PSCs processed with low band gap copolymers were notably lower than their SC equivalents . Furthermore, up to now, all attempts for PSC fabrication by push-coating have been limited to regular device architectures.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation