Reaction of Ru 3 (CO) 12 with 6 eq. of b-diketone ligands (hfac)H, (tmhd)H, (acac)H and (tfac)H at 160-170 uC in a hydrocarbon solvent (pentane or hexane) affords the diketonate complexes [Ru(CO) 2 (hfac) 2 ] (1), [Ru(CO) 2 (tmhd) 2 ] (2), [Ru(CO) 2 (acac) 2 ] (3) and [Ru(CO) 2 (tfac) 2 ] (4) in high yields. These ruthenium complexes were characterized by spectroscopic methods; a single crystal X-ray diffraction study was carried out on one isomer of the tfac complex (4a), revealing an octahedral coordination geometry with two CO ligands located at cis-positions and with the CF 3 groups of the b-diketonate ligands trans to the CO ligands. Thermogravimetric analysis of complex (1) showed an enhanced volatility compared to the parent acac complex (3), attributed to the CF 3 group reducing intermolecular attraction. Employing complexes (1) and (2) as CVD source reagents, ruthenium thin films can be deposited at temperatures of 350 uC-450 uC under an H 2 atmosphere or at temperatures of 275 uC-400 uC using a 2% mixture of O 2 in argon as carrier gas. For deposition carried out using complex (1) and under 100% O 2 atmosphere, RuO 2 thin films with a preferred (200) orientation were obtained. The as-deposited thin films were characterized by surface and physical analytical techniques, such as scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), X-ray diffraction analysis (XRD) and four-point probe measurement.Ruthenium-containing thin films show great promise for fabricating bottom electrodes or non-corrosive diffusion barriers for next generation, tantalum oxide (Ta 2 O 5 ), barium strontium titanate (BST) and lead zirconate titanate (PZT) based nonvolatile random access memory (RAM) devices.1 The advantages of ruthenium over other conducting materials include: lower resistivity, good etching ability, good barrier properties against oxygen diffusion, high resistance against capacitor shorting due to the formation of hillocks, severe polarization fatigue and aging.2 Moreover, its oxide phase, RuO 2 , which crystallizes in the rutile structure, belongs to a class of conductive oxide materials that exhibit excellent chemical stability at higher temperatures in O 2 ambient. These combined characteristics make RuO 2 an idea candidate for the fabrication of diffusion barriers for contact metallizations in very large scale integration (VLSI) applications, buffer layers of high T c superconducting films on silicon, and electrodes of ferroelectric thin films.Chemical vapor deposition (CVD) has received more attention in recent years, particularly in depositing these ruthenium-containing thin films, for its obvious capability of alleviating problems associated with the physical vapor deposition or sputtering process, such as low conformal coverage, poor crystallinity, and high stress level. As a result, several Ru metal-containing complexes have been examined as potential CVD precursors, including (a) ruthenocene 3 and its alkyl substituted derivatives such as Ru (C 5 hfb~hexafluoro-2-butyne, and Ru 3 ...