2012
DOI: 10.1016/j.mee.2012.03.014
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C–V characteristics of epitaxial germanium metal–oxide–semiconductor capacitor on GaAs substrate with ALD Al2O3 dielectric

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Cited by 4 publications
(3 citation statements)
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“…30 Considering several material choices and strain engineering in the channel, Ge epitaxial films grown on a large bandgap GaAs material is of immense interest due to lattice match (mismatch $0.07%) which ensures larger critical thickness, lower dislocation density, and strain-free Ge epitaxial film. As a result, high-hole mobility of Ge and its narrow bandgap (E g ¼ 0.67 eV) make the GaAs/Ge heterojunction suitable for the fabrication of p-channel QW field effect transistors, solar cells, 31 MOSFETs, 32,33 and tunnel transistors. 34 Ge QW transistor structures on GaAs/Si with a GaAs upper barrier in a QW configuration are essential in order (i) to eliminate parallel conduction, 2,3 (ii) to provide large valence band offset [35][36][37][38] for hole confinement, (iii) to achieve high-quality high-k/III-V barrier interface with lower Dit, 39 (iv) to control lattice mismatch, 3 (v) to have better interface properties, (vi) to provide modulation doping 4,8 in the Ge QW structure, (vii) to control the OFF state leakage, and (viii) to improve Ohmic contact.…”
Section: Introductionmentioning
confidence: 99%
“…30 Considering several material choices and strain engineering in the channel, Ge epitaxial films grown on a large bandgap GaAs material is of immense interest due to lattice match (mismatch $0.07%) which ensures larger critical thickness, lower dislocation density, and strain-free Ge epitaxial film. As a result, high-hole mobility of Ge and its narrow bandgap (E g ¼ 0.67 eV) make the GaAs/Ge heterojunction suitable for the fabrication of p-channel QW field effect transistors, solar cells, 31 MOSFETs, 32,33 and tunnel transistors. 34 Ge QW transistor structures on GaAs/Si with a GaAs upper barrier in a QW configuration are essential in order (i) to eliminate parallel conduction, 2,3 (ii) to provide large valence band offset [35][36][37][38] for hole confinement, (iii) to achieve high-quality high-k/III-V barrier interface with lower Dit, 39 (iv) to control lattice mismatch, 3 (v) to have better interface properties, (vi) to provide modulation doping 4,8 in the Ge QW structure, (vii) to control the OFF state leakage, and (viii) to improve Ohmic contact.…”
Section: Introductionmentioning
confidence: 99%
“…Considering several material choices and strain engineering in the channel, Ge epitaxial film grown on a large bandgap GaAs material is of immense interest due to lattice match (mismatch $0.07%) which ensures larger critical thickness, lower dislocation density, and strain-free Ge epitaxial film. As a result, highhole mobility of Ge and its narrow bandgap (E g ¼ 0.67 eV) make the GaAs/Ge heterojunction suitable for the fabrication of p-channel QW field effect transistors, 17 solar cells, 18 metal-oxide semiconductor field effect transistors, 19,20 millimeter-wave mixer diodes, 21 temperature sensors, 22 photodetectors, 23,24 and quantum confinement devices. 25 In order to realize a high-performance Ge QW transistor structure, higher bandgap III-V barrier layers are essential in order (i) to eliminate parallel conduction, 2,3 (ii) to provide large valence band offset (DE v !…”
Section: Introductionmentioning
confidence: 99%
“…As a dielectric metal oxide, Al 2 O 3 exhibits a high transparency, large bandgap and excellent electrical insulation properties, hence it is widely applied in electronic devices and electrochemistry, e.g., as a protection layer [1,2,3,4,5,6]. Commonly used methods for making Al 2 O 3 films include sol-gel, sputtering, evaporation, physical vapor deposition (PVD), chemical vapor deposition (CVD) and atomic layer deposition (ALD) [7,8,9,10,11].…”
Section: Introductionmentioning
confidence: 99%