Calculation and simulation of the uniformity of grinding removal in ring polishing

Abstract

Ring polishing, also called continuous polishing, plays a very important role in the manufacturing of plane optical components with large aperture [1][2][3] . This paper theoretically analyses the problem of calculation and simulation of the uniformity of grinding removal in ring polishing. By using the MATLAB software, a series of simulation figures are given. Firstly, the relative motion path on the polishing lap of a point on the workpiece is obtained by programming.From the simulation results it could draw a conclusion that the motion path is complicated when rotating speed ratio is not equal to one. Thus, it's beneficial to the homogeneous material removal. Focus on the problem of the uniformity of grinding removal, then, this paper elaborates on the effect of material relative removal caused by factors such as rotating speed ratio and eccentricity theoretically [3] . When the size of the workpiece is large enough, it will be outside of the optical polishing pitch lap, and this paper will also discuss the material removal on the whole surface in this case. All the calculation and simulation will guide practice process.

Sparse subaperture stitching method for measuring large aperture planar optics

“…17,18 The relative motion track is always rotationally symmetrical in ring polishing and the amount of material removal is related to the radius. Thus, the height errors are identical when the points are in the same radius, [19][20][21] which can largely reduce the coverage area when the subaperture stitching method is used to measure the figure error of the surface. Some subapertures can be omitted from the fully-covered lattice, and some others are arranged as the sparse lattice to fit the rotationally symmetrical surface shape.…”