Calibration of Non Linear Properties of Pb(Zr, Ti)O<sub>3</sub>Cantilever Using Integrated Piezoresistive Sensor for High Speed Atomic Force Microscopy

Nam, Hojung; Kim, Young‐Sik; Cho, Seong-Moon; Lee, Caroline Sunyong; Bu, Jong‐Uk; Hong, Jae Won; Khim, Z. G.

doi:10.1143/jjap.41.7153

Cited by 11 publications

(3 citation statements)

References 6 publications

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“…[13,14,15,16,17,18,19] In particular the bending mode, in which a layer of piezoelectric material is supported by a passive substrate, is the most common design for PMUTs and it has been exploited in cantilever-type [5,20,21] and diaphragm type designs. [17,22,23] A large piezoelectric coefficient is also important for the actuating capabilities of transducers, by reducing the driving voltage and enabling potential integration with complementary metal oxide semiconductors (CMOS).…”

Section: Medical Imaging Transducersmentioning

confidence: 99%

Medical Applications of Piezoelectric Microelectromechanical Systems

Griggio

Kim

Ural

et al. 2013

Integrated Ferroelectrics

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Bulk piezoelectric ceramics and single crystals are widely used in medical applications, including medical ultrasonic imaging, therapeutic ultrasound, and drug delivery. This paper reviews possibilities for thin film micromachined components as alternatives to the bulk devices. Particular emphasis is placed on the development of a CMOScompatible ultrasound system. For this purpose, a piezoelectric ultrasound system on a Si substrate was fabricated using a diaphragm geometry transducer with PZT films. A 1-D array of 8 elements was designed and fabricated using 4 photolithography steps. Cavities under the resonating elements were obtained by XeF 2 etching from the top-side of the wafer. Capacitance and admittance spectra showed a resonance at ∼ 42 MHz for the fabricated structures with a quality factor of 2.1, this resonance was higher than the one predicted by the natural frequency equation for circular plate. Catch-and pitch-mode tests were performed in water. Sensing and actuating functionalities were demonstrated for the fabricated devices, with collected signals of 40 mV peak-to-peak at a distance of 7.2 mm during the catch-mode test and amplitudes as high as 15 mV peak-to-peak at a distance of 7.4 mm during the pitch-mode test. A bandwidth of 83% was calculated during pitch-mode test.

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Section: Medical Imaging Transducersmentioning

confidence: 99%

Medical Applications of Piezoelectric Microelectromechanical Systems

Griggio

Kim

Ural

et al. 2013

Integrated Ferroelectrics

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“…Feasible dry [1] and wet [2] etching processes with sufficient etching resolution have been developed for thin films. As a result, some thin film pMEMS devices have been demonstrated successfully [3,4]. Whereas, there are only two ways, chemical wet etching and physical sand blasting or ion milling [5], can effectively remove thick film or bulk Pb(Zr x Ti 1−x )O 3 (PZT) but the etching resolution and selectivity is not yet satisfactory.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of piezoelectric MEMS devices-from thin film to bulk PZT wafer

et al. 2008

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Integrating patterned functional piezoelectric layer onto silicon substrate is a key technique challenge in fabrication of piezoelectric Micro Electro Mechanical System (pMEMS) devices. Different device applications have different requirements on the thickness and in-plane geometry of the piezoelectric layers and thus have their own processing difficulties. In this paper, the techniques of integrating piezoelectric function into pMEMS has been discussed together with some diaphragm-based pMEMS devices which have relatively lenient requirement on patterning of the piezoelectric layers. Sol-gel thin film can meet the requirement of most of the sensor applications. The composite thick film is one of the promising solutions for thick film devices due to its good processing compatibility. Si/Pb(Zr x Ti 1−x )O 3 wafer bonding technique makes it possible to thin down the ceramic wafer to less than 10 μm by using chemical mechanical polishing, which, therefore, provide us another approach to integrate thick piezoelectric layer on silicon to cover the need of most of the thick film devices. Directly make double side aligned electrode patterns on bulk piezoelectric wafer/plate by using photolithography opens up a new area of pMEMS. The advantage of using bulk piezoelectric wafer/plate in pMEMS is that we can select commercial available ceramics or single crystals with excellent piezoelectric properties and thus ensure the overall performance of the devices.

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“…4 Partially collapsed CMUT transducers employing high-K dielectrics may address some but not all of these drawbacks. 5 Thin film piezoelectric materials offer a number of advantages including the large motions that can be generated, often with low hysteresis, the high available energy densities, as well as high sensitivity and low power requirements and have been used in various diaphragm based 6,7 and cantilever based [8][9][10] MEMS transducers. Piezoelectric micro-machined ultrasound transducers (PMUT) have been sought as a solution that can be actuated at much lower voltage levels and provide much lower electrical impedance per area, even in comparison with conventional bulk piezoelectric transducers.…”

mentioning

confidence: 99%