In this work, we propose a simple and efficient interfacial
modification
method for thin-film transistor (TFT)-1 with poor stability under
bias stress. For conventional top-contact TFT-2, the sputtering passivation
layer will cause the device to be in a short-circuit condition. We
used inverted coplanar-structured TFT-3 to separate the high conductivity
layer from the S/D electrodes to avoid the short-circuit failure of
the device, but this will cause a hump effect. Ultraviolet treatment
and air annealing were performed on TFT-3 simultaneously to obtain
TFT-4 with high mobility (μsat = 45.5 cm2 V–1 s–1), steep subthreshold
swing (SS = 86 mV/dec), and good bias stability (±20 V, 3600
s, NBS: −0.1 V, PBS: +0.9 V, PGDBS: +0.5 V). The forward and
reverse tests of TFT-1 and TFT-4 after the PGDBS test show that TFT-4
has a good stability of the asymmetric electrical bias. Finally, XRR,
XPS, AFM, and contact angle were tested to further investigate the
material mechanisms. In this paper, we show that the interfacial passivation
of TFT can effectively isolate the invasion of external water/oxygen
and compensate for interfacial defects and dangling bonds. The decomposition
and rearrangement of the oxide are induced by UV + thermal annealing,
which optimizes the stacking pattern of the cells, effectively reducing
the defect states and eliminating parasitic channels and the hump
phenomenon. Finally, an amorphous oxide semiconductor (AOS)-TFT instrument
with high mobility and good stability is prepared. The method in this
paper addresses the problem that the passivation layer cannot be prepared
by sputtering, which is a cost-effective process.