Case study for high volume lead-free wave soldering process with environmental benefits

Baylakoğlu, Ilknur; Hamarat, S.; Gokmen, H.; Meric, E.

doi:10.1109/isee.2005.1437002

Cited by 4 publications

(5 citation statements)

References 4 publications

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“…Leaded-based solder materials are hazardous and not environment friendly. The use of certain material elements is forbidden by the European Union Restriction of Hazardous Substances [3,4]. Thus, lead-free solder materials are introduced in the application of soldering in electronic packaging assemblies.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, lead-free solder materials are introduced in the application of soldering in electronic packaging assemblies. Furthermore, the use of nitrogen can increase the performance of using lead-free solder material in the manufacturing industry [4]. However, due to higher temperature required to melt lead free solder, silver content higher than 2% in lead free solder will induce stresses in assembly due to high mismatch in the coefficient of thermal expansion (CTE) [5].…”

Section: Introductionmentioning

confidence: 99%

“…In previous research, finite element analysis (FEA) that are involved in prediction the failure of solder joints by simulation methods [4,6,7]. However, this research mainly focuses on reliability of solder joints in other soldering processes.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Zahiri

Abas²,

Ng³

et al. 2022

ARFMTS

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The increasing demands in the miniaturization of microelectronic products promotes the automation of electronic assembly and manufacturing process such as laser soldering to deliver high quality and flexibility of solder joints. This paper investigates possibility of using computational fluid dynamics (CFD) to create simulation of laser soldering process. Heating process of solder phase was simulated Using finite volume method (FVM) and energy equation enabled. Results of the simulation was compared with experiment for validation. Generally, it is found that the solder formation is identical for both simulation and experimental process. Moreover, the temperature distribution shows that heating process of laser soldering has great heating distribution along the solder region.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Zahiri

Abas²,

Ng³

et al. 2022

ARFMTS

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“…Lead-free (Sn/Ag/Cu) wave soldering that enabled environment-friendly and high-volume production was proposed by Baylakoglu et al (2005), who investigated the significance of nitrogen in dross rate reduction, product quality, and process. Dross formation (Sn/Ag/Cu) in a nitrogen environment was compared with eutectic leaded solder (Sn/Pb) bath under an air atmosphere.…”

Section: Introductionmentioning

confidence: 99%

Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

Aziz

Abdullah

Khor

et al. 2016

JAFM

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This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs) using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn63Pb37) distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (456 K, 473 K, 523 K, 583 K, and 643 K) on the wave soldering of a 70 mm × 146 mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at 523 K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results.

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“…Various lead‐free alloys have been tested and used for electronic components and assemblies. There is a variety of potential replacements for eutectic tin‐lead solder, and early uses of alloys containing elements such as tin, silver, copper, and bismuth have shown some success (Baylakoglu, et al , 2005). Manufacturers face issues in migrating to lead‐free electronics including regulatory, market, and consumer, as well as technical.…”

Section: Introductionmentioning

confidence: 99%

Learning from the migration to lead‐free solder

Ciocci

Pecht

2006

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to characterize the motivations used into migrating to lead‐free solder by providing examples and directions for those making the material change.Design/methodology/approachThis work achieves its objective of identifying which electronic industry actions towards lead‐free soldering have been successful and why. The research reported the various motivating factors considered in adopting lead‐free electronics. To that end, the authors researched industry literature and discussed approaches with various companies and agencies. The scope of this paper is largely the board‐component level soldering process and companies involved in the international electronics industry.FindingsThe motivation to migrate to lead‐free solder has been and continues to be multi‐faceted. Issues include regulatory, commercial, and technical. Processing with lead‐free solder is successful, so the electronics industry's move towards environmentally compatible processes will meet regulated dates for change.Practical implicationsA company can learn how to incorporate environmental improvement principles resulting from the migration to lead‐free solder. Using that migration as a case study, the company can realize additional benefits by applying these principles to other product lines. Those interested in developing environmentally friendly products and processes can adopt the lessons that this paper identifies. Incorporation of lead‐free techniques, rather than resistance to change, is the result of adopting the lessons.Originality/valueThe paper presents a synopsis of the electronic industry's migration to lead‐free products and processes. It compares motivations for change that other studies have not compared. Manufacturers searching for direction and example to meet waste minimization goals will find the paper useful in providing such.

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Case study for high volume lead-free wave soldering process with environmental benefits

Cited by 4 publications

References 4 publications

Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Numerical Simulation of Laser Soldering Process on Pin Through Hole (PTH)

Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach

Learning from the migration to lead‐free solder

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