2020
DOI: 10.1021/acsami.0c08555
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Catalyst-Free Growth of Two-Dimensional BCxN Materials on Dielectrics by Temperature-Dependent Plasma-Enhanced Chemical Vapor Deposition

Abstract: Traditional methods to prepare two-dimensional (2D) B–C–N ternary materials (BC x N), such as chemical vapor deposition (CVD), require sophisticated experimental conditions such as high temperature, delicate control of precursors, and postgrowth transfer from catalytic substrates, and the products are generally thick or bulky films without the atomically mixed phase of B–C–N, hampering practical applications of these materials. Here, for the first time, we develop a temperature-dependent plasma-enhanced chemic… Show more

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Cited by 20 publications
(16 citation statements)
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“…Due to the rapid and large‐scale functionalization of 2D materials, Yi et al. [ 107 ] developed a temperature‐dependent plasma‐enhanced chemical vapor deposition (PECVD) method to directly grow 2D BC x N materials on non‐catalytic dielectrics by simply changing the growth temperature to adjust the composition of carbon, nitrogen, and boron for the first time. This method correspondingly adjusts the properties of the materials including the bandgap and electrical conductivity, which is difficult to achieve with other methods.…”
Section: Synthesis and Processing Of Flexible 2d Materialsmentioning
confidence: 99%
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“…Due to the rapid and large‐scale functionalization of 2D materials, Yi et al. [ 107 ] developed a temperature‐dependent plasma‐enhanced chemical vapor deposition (PECVD) method to directly grow 2D BC x N materials on non‐catalytic dielectrics by simply changing the growth temperature to adjust the composition of carbon, nitrogen, and boron for the first time. This method correspondingly adjusts the properties of the materials including the bandgap and electrical conductivity, which is difficult to achieve with other methods.…”
Section: Synthesis and Processing Of Flexible 2d Materialsmentioning
confidence: 99%
“…c) Schematic illustration of the seeded growth process of PECVD-grown GNSPs. Reproduced with permission [107]. Copyright 2014, American Chemical Society.…”
mentioning
confidence: 99%
“…It mainly depends on the growth temperature when other parameters such as precursor category, proportion, pressure, and power density are set up. 22 Etching dominates at low temperature. As the temperature increases, etching becomes weaker, while nucleation and deposition dominate.…”
Section: Plasma-enhanced Chemical Vapor Depositionmentioning
confidence: 99%
“…Here, we used RF-PECVD (13.56 MHz) owing to its high plasma density. As a result of the highly reactive nature of RF plasma, both thin-film deposition and etching of the deposited materials coexist. ,, Achieving an equilibrium between deposition and etching is the key for obtaining high-quality 2D materials by PECVD (Figure c). It mainly depends on the growth temperature when other parameters such as precursor category, proportion, pressure, and power density are set up .…”
Section: Plasma-enhanced Chemical Vapor Depositionmentioning
confidence: 99%
“…It is clear that in a PECVD system, the electrons, electron-induced species, and electrical field plays crucial roles during material growth. In addition, working temperature-dependent influence should also be considered in a PECVD process …”
Section: Pa Depositionmentioning
confidence: 99%