“…Compared with traditional inorganic PCMs, organic solid–liquid PCMs have the advantages of a narrow phase-change temperature ( T pc ) interval, low subcooling, large energy storage density, and chemical stability, which have attracted much attention. , However, organic solid–liquid PCMs still have problems, such as easy leakage, limiting their potential applications. , In order to resolve the problem of leakage during the phase change, the following PCMs have been developed, such as form-stable PCMs, , solid–solid polymeric PCMs, ,, and microencapsulated PCMs. − Mixing the solid–liquid phase-change components with the polymeric supporting materials via noncovalent interactions can contribute to the formation of form-stable PCMs with an encapsulation fraction lower than 80%. ,, Solid–solid polymeric PCMs avoid the leakage of phase-change components by restricting the molecular chain movement ability by covalent bonding, which leads to a decrease in the latent heat efficiency (η) and latent heat density (Δ H ). , By encapsulating the phase-change core (PCC) in the shell material, microencapsulated PCMs or phase-change microcapsules can effectively improve the thermal conduction coefficient, specific surface area, and η of PCMs, and these advantages endow them with great application prospects in smart furniture, smart fibers, and solar energy storage and utilization. , …”