2003
DOI: 10.1063/1.1562737
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Catalytic graphitization and Ohmic contact formation on 4H–SiC

Abstract: Electrical contact properties and graphitic structures of metal/carbon/4H–SiC structures are investigated. Metals studied include Ni, Co, Cr, NiCr, Ti, W, Mo, Al, and Au. Ohmic contacts are formed on Ni/C, Co/C, Cr/C, and NiCr/C films on 4H–SiC with n-type, C-face, and a doping concentration of 1.8×1019 cm−3 . Only Ni/C and Co/C films exhibit Ohmic contact behavior on SiC with n-type, Si-face, and a doping concentration of 1.6×1018 cm−3. Ni and Co are well known as excellent graphitization catalysts. Raman spe… Show more

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Cited by 61 publications
(33 citation statements)
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“…Indeed, Lu et al [63] find a very low resistance of the thermally treated SiC contacts with nickel and cobalt, while other metals, which form carbides and thereby remove the graphitic inclusions, were rectifying. Seyller et al measured the Schottky barrier between n-type 6H-SiC(0001) and graphite by photoelectron spectroscopy and found a low value of 0.3 eV [64].…”
Section: Feature Articlementioning
confidence: 99%
“…Indeed, Lu et al [63] find a very low resistance of the thermally treated SiC contacts with nickel and cobalt, while other metals, which form carbides and thereby remove the graphitic inclusions, were rectifying. Seyller et al measured the Schottky barrier between n-type 6H-SiC(0001) and graphite by photoelectron spectroscopy and found a low value of 0.3 eV [64].…”
Section: Feature Articlementioning
confidence: 99%
“…Indeed, Lu et al [21] find a very low resistance for thermally treated SiC contacts with nickel and cobalt, while other metals, which form carbides and thereby remove the graphitic inclusions, were rectifying. Recently Seyller et al measured the Schottky barrier between n-type 6H-SiC(0001) and graphite by photoelectron spectroscopy and found a low value of 0.3 eV [22].…”
mentioning
confidence: 99%
“…The 'free carbon' is a product of the reaction between Ni and SiC to form Ni 2 Si and C during the ohmic contact annealing step, [7,8] while the oxygen is a result of exposure to air between the ohmic contact anneal and the subsequent TaSi x deposition. The AES depth profiles obtained from set A contacts shortly before electrical failure (24 h) and after electrical failure (36 h) show oxidation throughout the TaSi x layer.…”
Section: Table 1 Layer Thicknesses and Doping Concentrations In The mentioning
confidence: 99%