Cavity Filling Analysis for the Fabrication of an Alignment Structure in Micro Hot Embossing

Abstract

The flow behavior of polymers was analyzed using a commercial finite element software, DEFORM-2D, for the replication of microstructures. An alignment structure for microassembly, a hemisphere-tipped post, was modeled to demonstrate the polymer flow in hot embossing. The mold filling with polymer was evaluated by the heights of molded posts. The results of simulation showed better replication fidelity of the post with the increase of the molding temperature and displacement of the mold insert. The complete filling of a mold cavity was achieved at the molding temperatures of 112.5, 125, 137.5, and 150°C when the displacements were 1.5, 2.0 and 2.5 mm. The model can be used to design the process parameters for the reliable replication of microstructures.