Ceramic Mask‐Assisted Flame Spray Pyrolysis for Direct and Accurate Patterning of Metal Oxide Nanoparticles

Abstract

The ceramic mask‐assisted flame spray pyrolysis (CMA‐FSP) is a method for creating accurate micron sized spots of different shapes by depositing of metal oxide nanoparticles directly onto user defined substrates. The patterning process uses free‐standing alumina thin films with well‐defined holes as reusable ceramic masks.

Flame aerosol synthesis of nanostructured materials and functional devices: Processing, modeling, and diagnostics

“…xylene:tetrahydrofuran=1:1 [140] Cobalt naphthenate mineral spirits/xylene [351]; [361] Cobalt(II) nitrate(+4H2O,+6H2O) 100 1-propanol [148] 55 +6H2O) Ethanol [141]; [148] Methanol [148] methanol:propionic acid=1:1; ethanol:propionic acid=1:1; 1-propanol:propionic acid=1:1; propionic acid/1-octanol; propionic acid/1-pentanol [148] Water [46]; [48] Cobalt [154] Water [46] Nickel(II) propionate water/propionic acid [153] Nickel [109]; [162]- [164] xylene:acetonitrile=1:1 [367] Copper Ethanol [161] Isopropanol [168] Water [49]; [157] water/citric acid(as the chelating agent) [166] Copper propionate water/propionic acid [44]; [45] Zinc naphthenate Ethanol [106]; [169]; [170] Toluene [52]; [468] toluene:acetonitrile=4:1 [171] toluene:acetonitrile=8:1 [466] [467] Toluene:methanol=7:3 [172] Methanol:acetic acid=1:1 [80] mineral spirits/xylene [427] Zinc water/acetic acid [133] water/nitric acid [179] Strontium chloride 874 water/nitric acid [179] Strontium nitrate 570 Dimethylformamide [108] dimethylformamide:ethanol=4:1 [108] Water…”

“…The well-established processing routes for preparing ceramic thin films include colloidal-based wet coating processes, e.g., spin coating, slip coating, dip coating, etc., and dry aerosol-based particle deposition, e.g. electrospray deposition, plasma spraying deposition, and flame aerosol deposition (FAD)[9][427]. Wet-based processes require time intensive and often complex procedures to reduce capillary stresses or particle agglomeration, along with environmental concerns of liquid byproducts[427].…”

“…electrospray deposition, plasma spraying deposition, and flame aerosol deposition (FAD)[9][427]. Wet-based processes require time intensive and often complex procedures to reduce capillary stresses or particle agglomeration, along with environmental concerns of liquid byproducts[427]. In contrast, dry processes not only exclude these disadvantages because of the direct deposition of particles from the gas phase, but also are much simpler and require fewer unit operations.…”