Challenges &amp;amp; solutions in the die attach process for micro thin die

Looe, Siew Han; Wang, Soon Wei

doi:10.1109/iemt.2008.5507793

Cited by 3 publications

(1 citation statement)

References 4 publications

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“…These technologies have also fostered the advancement of die-attach and chip-bonding techniques, which are essential for the packaging and assembly of microelectronic components. Conventional chip-bonding technologies spanning wire or thermosonic bonding and flip-chip bonding, have been improving in terms of throughput and reliability [1], but still cannot process flexible dies [2], nor accommodate the conformal attachment of dies on-chip with non-planar surface morphologies [3,4]. However, novel integration schemes and printable materials [5] have enabled innovative configurations, such as flexible and stretchable devices, aligned with environmental concerns for greener approaches [6].…”

Section: Introductionmentioning

confidence: 99%

Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

et al. 2021

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Current challenges in printed circuit board (PCB) assembly require high-resolution deposition of ultra-fine pitch components (<0.3 mm and <60 μm respectively), high throughput and compatibility with flexible substrates, which are poorly met by the conventional deposition techniques (e.g., stencil printing). Laser-Induced Forward Transfer (LIFT) constitutes an excellent alternative for assembly of electronic components: it is fully compatible with lead-free soldering materials and offers high-resolution printing of solder paste bumps (<60 μm) and throughput (up to 10,000 pads/s). In this work, the laser-process conditions which allow control over the transfer of solder paste bumps and arrays, with form factors in line with the features of fine pitch PCBs, are investigated. The study of solder paste as a function of donor/receiver gap confirmed that controllable printing of bumps containing many microparticles is feasible for a gap < 100 μm from a donor layer thickness set at 100 and 150 μm. The transfer of solder bumps with resolution < 100 μm and solder micropatterns on different substrates, including PCB and silver pads, have been achieved. Finally, the successful operation of a LED interconnected to a pin connector bonded to a laser-printed solder micro-pattern was demonstrated.

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