2023
DOI: 10.1016/j.mattod.2023.04.021
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Challenges and opportunities in low-dimensional thermoelectric nanomaterials

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Cited by 37 publications
(12 citation statements)
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“…In the development of efficient thermoelectric materials (quantified through a figure-of-merit zT), nanostructuring and lowdimensional thermoelectric materials have been utilized to improve electronic and transport properties compared to bulk counterparts through increased phonon mean-free-path range, quantum confinement, and spatial confinement of energy carriers. 11 Apart from the development of low thermal conductivity thermoelectric materials, the other focus on reducing thermal resistance is via the overall device assembly. This has been covered by several research groups through the minimization of interfacial thermal resistances, 12,13 thermal impedance matching, 14 leg aspect ratio, 15,16 and fill factor 17,18 (Figure 2).…”
Section: ■ Thermoelectrics For Waste Heat Recoverymentioning
confidence: 99%
“…In the development of efficient thermoelectric materials (quantified through a figure-of-merit zT), nanostructuring and lowdimensional thermoelectric materials have been utilized to improve electronic and transport properties compared to bulk counterparts through increased phonon mean-free-path range, quantum confinement, and spatial confinement of energy carriers. 11 Apart from the development of low thermal conductivity thermoelectric materials, the other focus on reducing thermal resistance is via the overall device assembly. This has been covered by several research groups through the minimization of interfacial thermal resistances, 12,13 thermal impedance matching, 14 leg aspect ratio, 15,16 and fill factor 17,18 (Figure 2).…”
Section: ■ Thermoelectrics For Waste Heat Recoverymentioning
confidence: 99%
“…Recent reports on this aspect have shown that 1D chalcohalides (layered semiconductors) may be a solution to the overcoming the complexity of the energyconversion problem. 24,25 The crystal structure of these systems can be used as a gene to perform high-throughput searches for intriguing novel thermoelectric candidates that may be favorable for device fabrication.…”
Section: Introductionmentioning
confidence: 99%
“…An additional leverage to control Si NSs is their agglomeration. Si NS bundling is of paramount relevance in many applications, from antireflective layers in photovoltaic cells to sensors , and from electronics to thermoelectric devices. , Concerning thermoelectrics, tip agglomeration introduces additional electrical contact resistances that are noxious to the device efficiency . Factors affecting tip bundling were then analyzed to either reduce or enhance its extent.…”
Section: Introductionmentioning
confidence: 99%