Challenges and opportunities in non-destructive characterization of stacked IC packaging: insights from SAM and 3D x-ray analysis

Abstract

This study scrutinizes the limitations and challenges of applying non-destructive techniques such as Scanning Acoustic Microscopy (SAM) and 3D X-ray imaging for testing 3D and 2.5D integrated circuit (IC) packaging configurations. As the semiconductor industry moves towards advanced packaging technologies like 2.5D and 3D heterogeneous integration, which integrates various dies or chiplet components vertically and horizontally to enhance device performance and reduce costs, ensuring the reliability of these complex structures becomes paramount. This paper presents a comprehensive review of the current state-of-the-art non-destructive methods used for physical inspection, characterization, and failure analysis, with a focus on SAM and 3D X-ray imaging. It discusses the pressing challenges faced by these methods due to ongoing miniaturization and the need for high precision in inspecting densely packed components. An empirical investigation is conducted through a case study of a multi-die advanced packaging scenario to evaluate the practical utility of SAM and 3D X-ray techniques. This examination includes comparisons of resolution, analysis window size, aiming to understand the benefits of integrating these imaging modalities. The study also explores the future needs and opportunities for advancement in imaging hardware and algorithm development for automated signal interpretation and AI-assisted defect detection. This investigation highlights the critical role of non-destructive methods in advancing semiconductor packaging technologies while addressing their current limitations and the path forward for enhancing IC package integrity and reliability.