2017
DOI: 10.1016/j.egypro.2017.09.274
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Challenges for lowly-doped phosphorus emitters in silicon solar cells with screen-printed silver contacts

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Cited by 27 publications
(14 citation statements)
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“…Our result also represents a considerable advance compared to conventional screen printed Ag metallisation on e.g. phosphorus‐doped emitters with J 0,met > 1000 fA cm −2 . The application is interesting for more industrial type high‐efficiency p‐type solar cells with boron‐doped polysilicon layer on the rear side and a screen‐printed metal grid on top with around 5% coverage, for which a total rear side recombination J 0,rear total contribution of ≈20 fA cm −2 is expected (assuming 840 °C firing).…”
mentioning
confidence: 72%
“…Our result also represents a considerable advance compared to conventional screen printed Ag metallisation on e.g. phosphorus‐doped emitters with J 0,met > 1000 fA cm −2 . The application is interesting for more industrial type high‐efficiency p‐type solar cells with boron‐doped polysilicon layer on the rear side and a screen‐printed metal grid on top with around 5% coverage, for which a total rear side recombination J 0,rear total contribution of ≈20 fA cm −2 is expected (assuming 840 °C firing).…”
mentioning
confidence: 72%
“…The ECV mea­sure­ments are performed on initially alkaline textured sur­faces and are corrected to match the local R sh measured by 4 pp in the area of the posterior ECV measurement point (the correction procedure is described in detail in Ref. ; the near‐surface correction is not performed in the present work as the surface depletion is not an artefact for boron dop­ing profiles). As the textured surface is partly melted by the laser process, the resulting surface factor is smaller than for non‐lasered textured surfaces.…”
Section: Overview Of the Settings Used For Laser Doping From The Glasmentioning
confidence: 99%
“…For high temperature diffused junction solar cells, the conductive layer is the heavily doped emitter, which shows a sheet resistance typically ranging from 40 Ω/□ to 100 Ω/□ 1 . Optimization of the diffused emitter has dealt with the trade-off between contact resistivity with metal grids and Auger recombination (increases quadratically with doping density) 2 . This compromise leads to fill factor (FF) losses for lower doping densities and opencircuit voltage (Voc) losses for higher doping densities.…”
Section: Introductionmentioning
confidence: 99%
“…ConclusionsIn the present work, we demonstrate a SHJ solar cell design substituting the TCO layer by lateral conduction of c-Si absorber. Using only the c-Si bulk for lateral conduction, excellent lateral carrier collection was verified by achieving a fill factor of 80.7% and a low series resistance of 0.32 Ω•cm2 . Metal diffusion into a-Si:H layer was observed in the direct metal/a-Si:H contacts.…”
mentioning
confidence: 99%