“…and susceptibility to external stresses (moisture, heat, radiation, and electric field), , resulting in short device lifetime. − Moreover, the material imperfections and external stresses are entangled and effectively enforce each other. Many recent researches have been engaged to develop new material growth procedures , to minimize the intrinsic material imperfections so that the cascaded degradation processes would not start at the outset, but they mostly rely on speculations and trial-and-error approaches because of limited knowledge in actual happenings during material growth …”