Challenges in optoelectronic component packaging for next generation pluggable modules

Abstract

A review of trends in optoelectronic packaging at the component and module level is presented. The trends towards smaller form factor, and lower power dissipation is discussed and the results of a cooled micro TOSA is described. The importance of micro cooler technology and micro optics to the overall technical solution is discussed, along with the application of this technology to higher functionality transmitters.