Challenges of Power Electronic Packaging

Liu, Yong

doi:10.1007/978-1-4614-1053-9_1

Cited by 4 publications

(3 citation statements)

References 8 publications

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“…Kemasan merupakan bagian terluar dari suatu produk yang berfungsi untuk menempatkan suatu produk agar mempunyai bentuk-bentuk yang memudahkan penyimpanan, pengangkutan dan distribusi [2]. Kemasan memiliki kemampuan menyampaikan pesan properti produk, mempengaruhi perasaan konsumen dan memunculkan harapan untuk membeli [3].…”

Section: Pendahuluanunclassified

Analisis Kepuasan Pelanggan Dengan Pendekatan Model Kano Dan Quality Function Deployment (Qfd) Dalam Meningkatkan Kualitas Desain Kemasan Minuman Herbal Serbuk

Amalia,

Nasution

2023

tekno

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Pentingnya suatu atribut dalam kualitas sebuah produk sangat mempengaruhi kepuasan pelanggan. Kemasan merupakan salah satu atribut yang menjadi faktor penting sebagai daya tarik pembelian suatu produk. Pada penelitian ini dibahas terntang kepuasan pelanggan dalam meningkatkan kualitas desain kemasan. Selama ini, penggunaan kemasan dari minuman herbal serbuk menggunakan kemasan yang dipesan kepada supplier tanpa adanya riset internal tentang kemasan. D'Bu Jiran belum dapat melakukan ekspansi pasar secara meluas karena tidak memiliki bagian khusus untuk membahas desain kemasan yang diinginkan dan diharapkan oleh pelangg. Tujuan penelitian ini adalah untuk menganalisa kepuasan pelanggan terhadap desain kemasan. Pendekatan model Kano dilakukan untuk mengkategorikan atribut keinginan pelanggan kedalam kategori Kano dan metode Quality Function Deployment (QFD) untuk menerjemahkan keinginan pelanggan menjadi pengembangan yang dapat dihasilkan oleh pihak UMKM D’Bu Jiran. Penelitian ini menggunakan kuesioner sebagai instrument penelitian. Melalui hasil penyebaran kuesioner didapatkan 8 variabel keinginan yang dibutuhkan oleh pelanggan dan dikelompokkan berdasarkan 4 kategori Kano. Pengembangan desain kemasan ini fokus pada kategori One Dimensional dan Attractive. Hasil QFD diketahui bahwa variabel customer need “informatif” dan technical response “menambahkan informasi produk” menjadi prioritas pertama dalam pengembangan desain kemasan minuman herbal serbuk.

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Section: Pendahuluanunclassified

Analisis Kepuasan Pelanggan Dengan Pendekatan Model Kano Dan Quality Function Deployment (Qfd) Dalam Meningkatkan Kualitas Desain Kemasan Minuman Herbal Serbuk

Amalia,

Nasution

2023

tekno

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Section: Introductionmentioning

confidence: 99%

“…The design rules and material and structure layout of power packaging are quite different from regular memory and digital IC packaging. Due to the intrinsic high current density and high operation temperature, the performance requirements for APM are extremely high, especially in handling harsh thermal and electrical environments [3].To reduce cost and improve time to market, electrical, thermal, molding flow and mechanical modeling and simulation are applied to investigate the electrical, thermal, molding and reliability performance in each design phase and assembly process of an advanced APM. In our previous efforts in assembly process, the air vent and its effect on molding process was studied [4]; Die thinning process was investigated for a power system in package (SiP), the parameter analysis and reliability study for a power SiP design were presented [5-6].…”

mentioning

confidence: 99%

Design and assembly process simulation for an automotive power module

Liu

Qian

Lee

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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In this paper, an automotive power module (APM) package is considered with multiple die including MOSFETs, passive components, shunt resistor and thermistor attached on the direct bonded copper (DBC) substrate. 3D finite element models for design and assembly process are generated in order to conduct the DoE numerical simulations for each design and assembly process. In design phase, both electrical and thermal simulations are carried out to improve the electrical and thermal performance. The electrical resistance and inductance are examined in order to minimize the package effects on Rds(on) and switching noise. Thermal characterization is conducted for the APM heat dissipation design evaluation. In assembly manufacturing process, molding is a very critical process to ensure the high reliability of the APM product. Molding simulation is discussed to check the flow front, gate design option and the possible voids track. The mechanical simulation is also conducted to check the warpages and stresses after molding and the APM mounting process to see if package cracking, or delamination might occur in these assembly processes. Modeling is conducted to determine the proper clamping force for low clearance and avoid high stress in ceramic. IntroductionAutomotive power module (APM) technology is one of the fastest growing areas in power semiconductor industry due to the rapid advances in power integrated circuit (IC) fabrication and the demands of a growing market in automotive industry, especially for electric vehicle (EV) and hybrid electric vehicle (HEV) areas [1][2]. The design rules and material and structure layout of power packaging are quite different from regular memory and digital IC packaging. Due to the intrinsic high current density and high operation temperature, the performance requirements for APM are extremely high, especially in handling harsh thermal and electrical environments [3].To reduce cost and improve time to market, electrical, thermal, molding flow and mechanical modeling and simulation are applied to investigate the electrical, thermal, molding and reliability performance in each design phase and assembly process of an advanced APM. In our previous efforts in assembly process, the air vent and its effect on molding process was studied [4]; Die thinning process was investigated for a power system in package (SiP), the parameter analysis and reliability study for a power SiP design were presented [5-6]. However, there seems few work on the systematic evaluation for an APM design and assembly process. In this paper, an APM is investigated with multiple

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Shear strength of Cu-to-Cu joints using mixed Ag particle paste

Nishikawa

Niwa

2015

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

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The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high -temperature applications. In this study, microscale Ag particle pastes were experimentally applied and the effect of the addition of nanoscale particles into microscale particle pastes on C u-to-Cu joint has been studied to improve the shear strength of Cu -to-Cu joint using a microscale particle paste. Then, th e effect of bonding condition on the shear strength of Cu-to-Cu joint has been investigated. It was found that the shear strength of the joint using a 50/50 mixed paste was more than 20 MPa at 300 ºC for 600 s under joining pressure of 5 MPa in air.

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Challenges of Power Electronic Packaging

Cited by 4 publications

References 8 publications

Analisis Kepuasan Pelanggan Dengan Pendekatan Model Kano Dan Quality Function Deployment (Qfd) Dalam Meningkatkan Kualitas Desain Kemasan Minuman Herbal Serbuk

Analisis Kepuasan Pelanggan Dengan Pendekatan Model Kano Dan Quality Function Deployment (Qfd) Dalam Meningkatkan Kualitas Desain Kemasan Minuman Herbal Serbuk

Design and assembly process simulation for an automotive power module

Shear strength of Cu-to-Cu joints using mixed Ag particle paste

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