1995
DOI: 10.1016/0257-8972(95)08339-1
|View full text |Cite
|
Sign up to set email alerts
|

Change in the phase growth rates in Cu-Si films subjected to ion implantation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2000
2000
2019
2019

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(2 citation statements)
references
References 3 publications
0
2
0
Order By: Relevance
“…Cu–Si bilayers (100 nm Cu layers deposited on thermally oxidized silicon and followed by Si layers of different thickness, between 40 and 120 nm) were prepared by Shpilewsky et al. [27] . Some of them were subjected to implantation of Ar ions.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Cu–Si bilayers (100 nm Cu layers deposited on thermally oxidized silicon and followed by Si layers of different thickness, between 40 and 120 nm) were prepared by Shpilewsky et al. [27] . Some of them were subjected to implantation of Ar ions.…”
Section: Resultsmentioning
confidence: 99%
“…By comparing implanted and non-implanted samples after annealing at different temperatures between 100 and 700 °C they observed that ɛ-Cu 15 Si 4 is only formed in implanted samples where the maximum density of implanted Ar is close to the Cu/Si interface. They concluded that initiation of ɛ-Cu 15 Si 4 during irradiation and subsequent annealing may then be attributed to a change in thermodynamic and kinetic parameters of phase formation on ion implantation [27] .…”
Section: Resultsmentioning
confidence: 99%