Chaotic dynamics of three-dimensional DC magnetron discharge

Kondo, S.; Nanbu, Kenichi

doi:10.1109/27.763058

Cited by 7 publications

(4 citation statements)

References 1 publication

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“…In previous work [20,29] we found and studied a threedimensional instability in the magnetron of racetrack type under a certain discharge condition. As the applied voltage or magnetic field strength becomes smaller, the current decreases and finally the discharge extinguishes [30].…”

Section: Resultsmentioning

confidence: 99%

A self-consistent numerical analysis of a planar dc magnetron discharge by the particle-in-cell/Monte Carlo method

Kondo

Nanbu

1999

J. Phys. D: Appl. Phys.

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The structure of axisymmetrical dc planar magnetron discharge is clarified by the use of the particle-in-cell/Monte Carlo method. The magnetron has two concentric cylindrical magnets behind the cathode. Here the effects of magnetization in the magnets, M, and the emission coefficient of secondary electrons, γ , on the discharge structure are examined. Four discharge conditions are considered: (i) M = 0.50 T and γ = 0.12, (ii) M = 0.75 T and γ = 0.12, (iii) M = 1.00 T, γ = 0.12 and (iv) M = 0.50 T and γ = 0.15. The complete steady states are obtained for the four cases; no oscillations or waves are found in the plasma. The electrical field component normal to the electrode varies greatly in the axial and radial directions near the cathode. The plasma-density profile exhibits a peak near the edge of the cathode sheath. As M or γ increases, the sheath thickness decreases. Also, the spatial distributions of the space charge, ion flux onto the cathode, ion mean kinetic energy and rates of inelastic collision of electrons are examined in detail.

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Section: Resultsmentioning

confidence: 99%

A self-consistent numerical analysis of a planar dc magnetron discharge by the particle-in-cell/Monte Carlo method

Kondo

Nanbu

1999

J. Phys. D: Appl. Phys.

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“…Various parameters and physical processes in a magnetron sputtering discharge have been explored using a 2D PIC/MCC modeling including, the velocity distribution of electrons and ions (Shon et al 1998), the gas temperature by tracking the neutral species (fast atoms of the working gas and sputtered atoms) (Kolev and Bogaerts 2008), the erosion profile and transport of sputtered species (Kolev and Bogaerts 2009), and the effect of magnetic field strength and secondary electron emission (Kondo and Nanbu 1999b). In 3D PIC/MCC simulation Kondo and Nanbu (1999a) observed chaotic dynamics within the electron density. This approach has also been used to simulate the physical processes in a magnetron discharge during reactive sputter deposition of TiN x films in Ar/N 2 and TiO x films in Ar/O 2 , discharges.…”

Section: Boltzmann Solver and Lorenz Force Termmentioning

confidence: 99%

Physics and technology of magnetron sputtering discharges

Guðmundsson

2020

Plasma Sources Sci. Technol.

354

219

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Magnetron sputtering deposition has become the most widely used technique for deposition of both metallic and compound thin films and is utilized in numerous industrial applications. There has been a continuous development of the magnetron sputtering technology to improve target utilization, increase ionization of the sputtered species, increase deposition rates, and to minimize electrical instabilities such as arcs, as well as to reduce operating cost. The development from the direct current (dc) diode sputter tool to the magnetron sputtering discharge is discussed as well as the various magnetron sputtering discharge configurations. The magnetron sputtering discharge is either operated as a dc or radio frequency discharge, or it is driven by some other periodic waveforms depending on the application. This includes reactive magnetron sputtering which exhibits hysteresis and is often operated with an asymmetric bipolar mid-frequency pulsed waveform. Due to target poisoning the reactive sputter process is inherently unstable and exhibits a strongly non-linear response to variations in operating parameters. Ionized physical vapor deposition was initially achieved by adding a secondary discharge between the cathode target and the substrate and later by applying high power pulses to the cathode target. An overview is given of the operating parameters, the discharge properties and the plasma parameters including particle densities, discharge current composition, electron and ion energy distributions, deposition rate, and ionized flux fraction. The discharge maintenance is discussed including the electron heating processes, the creation and role of secondary electrons and Ohmic heating, and the sputter processes. Furthermore, the role and appearance of instabilities in the discharge operation is discussed.

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“…: Refs. 29,34,[36][37][38] ). However, we have checked that this method will not affect the properties studied here, by cutting off the simulations after various different times.…”

Section: Description Of the Modelmentioning

confidence: 99%

Kinetic simulation of direct-current driven microdischarges in argon at atmospheric pressure

Zhang¹,

Jiang²,

Bogaerts³

2014

J. Phys. D: Appl. Phys.

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A one-dimensional, implicit particle-in-cell Monte Carlo collision model is used to simulate the plasma kinetic properties at steady state in a parallel-plate direct current argon glow microdischarge under various operating conditions, such as driving voltage (30 − 1000 V) and gap size (10 − 1000 µm) at atmospheric pressure. First, a comparison between rf and dc modes is shown for the same pressure, driving voltage and gap spacing. Furthermore, the effect of gap size scaling (in the range of 10 − 1000 µm) on the breakdown voltage, peak electron density and peak electron current density at breakdown voltage is examined. The breakdown voltage is lower than 150 V in all gaps considered. The microdischarge is found to have a neutral bulk plasma region and a cathode sheath region with size varying with the applied voltage and the discharge gap. In our calculations, the electron and ion densities are of the order of 10 18 − 10 23 m −3 , which is in the glow discharge limit, as the ionization degree is lower than1%. The electron energy distribution function (EEDF) shows a two-energy group distribution at a gap of 10 µm, and a three-energy group distribution at larger gaps such as 200 and 1000 µm, emphasizing the importance of the gap spacing in dc microdischarges.

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Chaotic dynamics of three-dimensional DC magnetron discharge

Cited by 7 publications

References 1 publication

A self-consistent numerical analysis of a planar dc magnetron discharge by the particle-in-cell/Monte Carlo method

A self-consistent numerical analysis of a planar dc magnetron discharge by the particle-in-cell/Monte Carlo method

Physics and technology of magnetron sputtering discharges

Kinetic simulation of direct-current driven microdischarges in argon at atmospheric pressure

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