2011
DOI: 10.1016/j.carbon.2011.06.002
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Characterisation of graphite nanoplatelets and the physical properties of graphite nanoplatelet/silicone composites for thermal interface applications

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Cited by 113 publications
(56 citation statements)
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“…Silicone elastomer was also used as matrix to produce pastes and adhesives. The details of the fabrication and properties of these composites can be found elsewhere [15,16]. Briefly, appropriate amount of GNPs were mixed in rubbery epoxy resin or glassy epoxy resin by using conventional mechanical mixer with a high speed motor and a propeller attached to a shaft which was rotated at 2500 rpm for 20 min to make composite dispersions.…”
Section: Methodsmentioning
confidence: 99%
“…Silicone elastomer was also used as matrix to produce pastes and adhesives. The details of the fabrication and properties of these composites can be found elsewhere [15,16]. Briefly, appropriate amount of GNPs were mixed in rubbery epoxy resin or glassy epoxy resin by using conventional mechanical mixer with a high speed motor and a propeller attached to a shaft which was rotated at 2500 rpm for 20 min to make composite dispersions.…”
Section: Methodsmentioning
confidence: 99%
“…2). Although electrically conductive property can be tolerated in some fields, electrical conductivity is generally undesired for TIMs [6]. As presented in Fig.…”
Section: Resultsmentioning
confidence: 95%
“…Carbon-based materials and metallic fillers such as graphite [5], graphite/graphene nanoplateles (GNPs) [6,7], graphene [8], carbon nanotubes (CNTs) [9], carbon fiber [10,11], silver particles, silver nanowires [12], and copper nanowires [2,13] have been widely utilized to fabricate polymer-based TIMs owing to their extraordinary inherent thermal conductivity [14,15]. However, the incorporation of electrically conductive fillers will inevitably cause the great deterioration of electrical insulation performance, which hinders the wide use of these TIMs in next-generation microelectronics devices [16,17] such as LED devices with chips directly placing on the heat sink, single chip packages [18], and high-voltage devices.…”
Section: Introductionmentioning
confidence: 99%
“…For each iteration, the condition for which the thicknesses of the second phase remained congruent to those of the previous and following stages (~13 lm) corresponded to have thermal conductivity values of the GNP of about 4.85 W/mK, therefore very similar to those experienced by nano-graphites respect to a heat flow normal to the planes [42]. On the other hand, possible applications of the GNP conductivity similar to those shown along its plane (~1500-2000 W/mK) did not allow arriving at convergence.…”
Section: Gnp Planes Dispositionmentioning
confidence: 89%