3rd Electronics System Integration Technology Conference ESTC 2010
DOI: 10.1109/estc.2010.5642806
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Characterisation of silver particles used for the Low Temperature Joining Technology

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Cited by 6 publications
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“…Other impurities like copper, potassium and sodium are also typically found in the nanoscale Ag paste in the range of less than 1000 ppm, although it has been reported on rare occasion that the copper content may rise to ∼2700 ppm [31]. Sodium or potassium salts of the fatty acids which were used as lubricants for the milling process, were also detected in the Ag paste [31].…”
Section: Number Of Carbon Atomsmentioning
confidence: 97%
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“…Other impurities like copper, potassium and sodium are also typically found in the nanoscale Ag paste in the range of less than 1000 ppm, although it has been reported on rare occasion that the copper content may rise to ∼2700 ppm [31]. Sodium or potassium salts of the fatty acids which were used as lubricants for the milling process, were also detected in the Ag paste [31].…”
Section: Number Of Carbon Atomsmentioning
confidence: 97%
“…In general, the process steps of using nanoscale Ag paste were quite similar to that of micron-scale Ag paste [31][32][33][34]. There were also some reports which describe a different approach compared to micron-scale Ag sintering-eliminating the preheating stage before the die attachment step [35][36][37][38][39][40][41][42].…”
Section: Nano-scale Ag Pastementioning
confidence: 99%
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