Characteristic study of anisotropic-conductive film for chip-on-film packaging

Chang, Shuo‐Hung; Jou, Jwo‐Huei; Hsieh, Adam H.; Chen, Tai-Hong; Chang, Ching-Yun; Wang, YungHao; Huang, C. M.

doi:10.1016/s0026-2714(01)00221-9

Cited by 73 publications

(31 citation statements)

References 9 publications

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“…Figure 3 shows the COGs circuit design for electrical measurement and its equivalent circuit. 8 With a 1 mA constant current and a measured voltage, the contact resistance R 2 from bump 2 to the electrode through ACF was calculated by R 2 = V/I. The electrical resistance of the ITO electrode is relatively small when compared with the ACF contact resistance, thus it was neglected.…”

Section: Methodsmentioning

confidence: 99%

“…Obviously, the contact resistance was low with more compression of the particle when the force was larger, as pointed out in a previous study. 8 Combining the results of the contact resistivity and the compressive deformation suggests that the particle compression between the bump and the electrode should be between 0.2 and 0.68 for reliable COG bonding. Figure 13 shows the actual compression ratio of particles as a function of the gap between the bump and the electrode.…”

Section: Bump Height Variationmentioning

confidence: 99%

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Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Choi

Hwang

2008

Journal of Elec Materi

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Chip-on-glass (COG) interconnection using anisotropic conductive film (ACF) is susceptible to open failures. Open failures can be induced by the absence of conductive particles or an insufficient contact. Experimental results as well as statistical approaches were used to understand the conditions for open failures in COG bonding. The binomial distribution was used to predict the probability of the open failure due to the deficiency of conductive particles. The probability of an open failure decreased with increasing bump area and decreasing particle size. The bump height variation was also an important factor that affected the probability of the open failure together with the bump-to-electrode gap and the particle size. The variation in bump height should be minimized to avoid open failures in fine-pitch applications where a smaller particle size is required.

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Section: Methodsmentioning

confidence: 99%

Section: Bump Height Variationmentioning

confidence: 99%

Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Choi

Hwang

2008

Journal of Elec Materi

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“…Their results showed that (1) when the bonding pressure was set at 3 kgf/cm 2 , the higher the bonding temperature, the greater the bonding strength and (2) when the bonding temperature was set at 200 • C, the higher the bonding pressure, the greater the bonding strength. Chang et al [3] performed a full factorial experiment to investigate the contact resistance influence from the following three factors: bonding temperature, bonding pressure and bonding time. Each factor had three levels.…”

Section: Literature Reviewmentioning

confidence: 99%

Optimal parameter design for chip-on-film technology using the Taguchi method

Hong

2004

AMT

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Chip on film (COF) is a new technology aggressively developed by liquid crystal display (LCD) module manufacturers. COF is a potential replacement method for tape-automated bonding (TAB) and chip-on-glass (COG) technology. COF technology has the following advantages: low power consumption, low cost, small structure, light weight and high resolution. It has become the major LCD module application. However, COF technology has several nonconforming items that should be reduced. These items include bonding misalignment, insufficient bonding strength and surface mount technology (SMT), solder joint defects, etc. The purpose of this study is to determine the optimum process parameters for COF technology improvement. An L 18 orthogonal array is employed to conduct the design of experiment for finding the optimum process parameters. The results show that bonding misalignment is reduced and bonding strength increased.

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“…ACFs are also extensively used for connection between PCBs and LCD or liquid crystal module (LCM). Joining with anisotropic conductive adhesives and films is very fast and successfully spreading technology because of there is no requirement for applying additional underfill [1]. The basic materials of ACAs are thermoset or thermoplastic (usually epoxy resin) with conductive filler-mainly balls with conductive layer (polymer + Au, Ni + Au).…”

Section: Introductionmentioning

confidence: 99%

Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints

Duraj

Mach

Radev

et al. 2006

2006 1st Electronic Systemintegration Technology Conference

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Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materialsfor substitution ofcommon used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential materials for the bonding ofsurface mounted components andfor some special applications. In this research we arefocused on an investigation ofinfluence ofhigh current load on changes ofquality of adhesive joints. Monitoredparameters are electrical resistance and nonlinearity of V-C characteristics.

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Characteristic study of anisotropic-conductive film for chip-on-film packaging

Cited by 73 publications

References 9 publications

Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Statistical Characterization of Open Failures in the Fine-Pitch COG Interconnection

Optimal parameter design for chip-on-film technology using the Taguchi method

Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints

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