Characteristics of Distribution of Thermal Stresses Near Apex in Dissimilar Materials. Change of Distribution of Thermal Stresses on Vaviation of Singularity of Type log r.DARRLR.rp-1.

忠信, 井上; 日出男, 古口

doi:10.1299/kikaia.61.2461

Cited by 4 publications

(2 citation statements)

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“…Reduction in the residual stress near the edge of the interface is required to design and realize bonded dissimilar materials such as the ceramics/metal-joint system. Previous studies (Inoue et al, 1995a;Inoue et al, 1995b;Kimura et al, 2003;Koguchi et al, 1989;Koguchi et al, 1991;Tateno et al, 1993;Tateno et al, 1996) showed that an optimum interface-edge shape, which eliminates the stress singularity or reduces the index of stress singularity (Bogy, 1968;Bogy, 1971;Inoue et al, 1995a;Inoue et al, 1995b;Inoue et al,1996;Inoue, et al, 1997;Koguchi et al, 1989;Koguchi et al, 1991;Koguchi et al, 1997), improves the bonding strength. An optimum interface shape is expected to reduce the residual stress near the interface edge.…”

Section: Introductionmentioning

confidence: 98%

Effects of interface-edge angle on the bonding strength of a ceramics/metal joint with arc-free surface of interface edges

Tokumoto

Muraoka

Tominaga

et al. 2019

Mechanical Engineering Journal

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The focus of this study is to clarify the effects of an interface-edge shape on the bonding strength of a ceramics/metal joint. Each silicon nitride-to-nickel joint plate with an arc-shaped free-surface edge was prepared using wire-electric discharge machining after a bonding process. The interface-edge shape was characterized by defining an interface-edge angle as the configuration angle between the interface plane and tangential line at the arc edge of the bonded interface. The dependence of the bonding strength on the interface-edge angle was experimentally verified in the silicon nitride-to-nickel joint with an arc-shaped free surface of the interface edges. The result shows that enlarging or reducing the edge angle from a right angle improved the bonding strength because it reduced the residual stress near the interface edges in the ceramic side. Setting a suitable interface-edge condition using a secondary-bonding process produced the highest strength in a ceramics/metal-joint system. The free surface of the interface edges removed by the secondary-machining process was very smooth. Secondary machining can improve the surface integrity and redistribute the stress concentration because of the removal of the gap at the interface edges. This study demonstrates that secondary machining can be effective for improving the bonding strength.

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Section: Introductionmentioning

confidence: 98%

Effects of interface-edge angle on the bonding strength of a ceramics/metal joint with arc-free surface of interface edges

Tokumoto

Muraoka

Tominaga

et al. 2019

Mechanical Engineering Journal

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“…The reliability of bonded dissimilar materials has been studied with a view to reducing residual stress and obtaining the optimum geometric configuration of an interface using theoretical and numerical analyses. Previous theoretical and experimental studies (Arai, et al, 1993), (Bogy, et al, 1968), (Bogy, et al, 1971), (Hein, et al, 1971), (Inoue, et al, 1995), (Inoue, et al, 1995-11), (Inoue, et al, 1996), (Inoue, et al, 1999), (James, et al, 1989), (Kelly, et al, 1992), (Koguchi, et al, 1993), (Murata, et al, 1992), (Nakayama, et al, 2017), (Yang, et al, 1997), (Yokoi, et al, 2010), (Yokoi, et al, 2011) have shown that employing the optimum shape of an interface edge could improve the bonding strength and reliability of bonded dissimilar materials. Theoretical elastic analysis suggests that the optimum interface edge configuration leads to a disappearance of the stress singularity and a reduction in its index.…”

Section: Introductionmentioning

confidence: 99%

Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials

Muraoka

Tokumoto

Nakayama

et al. 2019

Mechanical Engineering Journal

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This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed, which consisted of an elastic material to represent the ceramics and an elastoplastic material in the case of the metal. In this finite element method (FEM) study, it was assumed that silicon nitride and nickel were bonded at high temperatures and cooled slowly. The thermal elastoplastic behavior on the free surface of the ceramic side near the edge of the interface was determined numerically. The dependence of thermal elastoplastic behavior on geometrical interfacial configuration was also clarified numerically using FEM models with various interface edge configurations. Results of the numerical analysis were compared with the dependence of practical tensile bonding strength on the interface edge angle of a silicon nitride/nickel joints system bonded at 780°C, with the same interface shape as that of the analytical model. The practical tensile bonding strength was improved by setting the optimum interface shape. The optimum interface shape was obtained by determining the effects of the interface wedge angle on practical tensile bonding strength. Results of thermal elastoplastic analysis for the FEM model and fracture patterns suggest that an appropriate interface shape can reduce thermal residual stress near the interface edges on the ceramic side.

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Conditions for compressive residual stress occurrence at interface edge of bonded dissimilar materials

Inoue

Muto

Hojo³

et al. 1999

Welding International

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Characteristics of Distribution of Thermal Stresses Near Apex in Dissimilar Materials. Change of Distribution of Thermal Stresses on Vaviation of Singularity of Type log r.DARRLR.rp-1.

Cited by 4 publications

References 0 publications

Effects of interface-edge angle on the bonding strength of a ceramics/metal joint with arc-free surface of interface edges

Effects of interface-edge angle on the bonding strength of a ceramics/metal joint with arc-free surface of interface edges

Effect of interface edge angle on stress distribution near the interface edge of bonded dissimilar materials

Conditions for compressive residual stress occurrence at interface edge of bonded dissimilar materials

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