2009
DOI: 10.3938/jkps.55.1022
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Characteristics of Hf-silicate Interfacial Layers Formed by WetEtching

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Cited by 4 publications
(2 citation statements)
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“…31 The Si 2p peak at BE 102.4 eV in the control sample is from the HfSiO x interface layer. 11,32 The nc-CdSe embedded sample has an additional Si peak at BE 103.1 eV, which is from the SiO 2 -like HfSiO x group. 11 It was reported that the Hf dangling bond can be formed during the high temperature PDA process.…”
Section: Methodsmentioning
confidence: 99%
“…31 The Si 2p peak at BE 102.4 eV in the control sample is from the HfSiO x interface layer. 11,32 The nc-CdSe embedded sample has an additional Si peak at BE 103.1 eV, which is from the SiO 2 -like HfSiO x group. 11 It was reported that the Hf dangling bond can be formed during the high temperature PDA process.…”
Section: Methodsmentioning
confidence: 99%
“…Early work on alternative gate dielectrics was focused on TiO 2 , Ta 2 O 5 , and BaSrTiO 3 , which were inherited from dynamic random access memory (DRAM) capacitor dielectric research [57][58][59][60]. Recently, Hf(Zr)-based oxides, including HfO 2 , ZrO 2 , and their silicates have emerged as promising candidates for high-k dielectrics because of their excellent thermal stability with Si [7,11,[61][62][63][64][65][66]. Furthermore, the mobility of CMOS devices using Hfbased high-k gate dielectrics has been improved significantly [67], almost matching that of nitride oxide at an EOT of $1 nm.…”
Section: Advance and Challenge In Current High-k Dielectric Developmentmentioning
confidence: 99%