“…Early work on alternative gate dielectrics was focused on TiO 2 , Ta 2 O 5 , and BaSrTiO 3 , which were inherited from dynamic random access memory (DRAM) capacitor dielectric research [57][58][59][60]. Recently, Hf(Zr)-based oxides, including HfO 2 , ZrO 2 , and their silicates have emerged as promising candidates for high-k dielectrics because of their excellent thermal stability with Si [7,11,[61][62][63][64][65][66]. Furthermore, the mobility of CMOS devices using Hfbased high-k gate dielectrics has been improved significantly [67], almost matching that of nitride oxide at an EOT of $1 nm.…”