Characteristics of Power Module with New Advanced Substrate

Hsu, Hao Chiang; Cheng, Lu-Ken; Chi, Wei-Hao; Liao, Hsueh-Kuo

doi:10.1109/impact50485.2020.9268538

Cited by 2 publications

(3 citation statements)

References 7 publications

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“…In contrast to the double-sided DBC substrate, IMS is a single-sided substrate, suggesting that only one side (i.e., the Cu side) can be installed with electronic components. IMSs have been extensively reported in the literature on power electronics applications [ 21 , 22 , 30 , 31 , 32 ]. According to the literature data, the thermal performance of an IMS is believed to be typically inferior to AlN DBC substrates mainly due to the low thermal conductivity of their dielectric layer.…”

Section: Development Of Sic/si Integrated Hybrid Power Modulementioning

confidence: 99%

“…To address these challenges, several different types of substrates were proposed, including insulated metal substrates (IMS), Si 3 N 4 , direct plate copper (DPC), etc. Among them, IMS is an attractive alternative as a result of its low cost in manufacturing, the good mechanical property of the insulation layer, great efficiency in layout usage, and even superior thermal and electrical performances [ 21 , 22 ]. Their thermal performance can be upgraded through the use of a thinner dielectric layer though this may unfortunately lead to a lower electrical resistance [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

“…Their thermal performance can be upgraded through the use of a thinner dielectric layer though this may unfortunately lead to a lower electrical resistance [ 23 ]. It was reported that a Cu- and Al-based IMS substrate with an insulating layer (IL) thickness of 0.12 mm outperforms an Al 2 O 3 DBC substrate with an IL thickness of 0.38 mm in thermal performance [ 22 ].…”

Section: Introductionmentioning

confidence: 99%

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Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications

et al. 2023

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This study aims to develop a 30 kHz/12 kW silicon carbide (SiC)/Si integrated hybrid power module (iHPM) for variable frequency drive applications, particularly industrial servo motor control, and, additionally, to theoretically and experimentally assess its dynamic characteristics and efficiency during operation. This iHPM integrates a brake circuit, a three-phase Si rectifier, and a three-phase SiC inverter within a single package to achieve a minimal current path. A space-vector pulse width modulation (SVPWM) scheme is used to control the inverter power switches. In order to reduce parasitic inductance and power loss, an inductance cancellation design is implemented in the Si rectifier and SiC inverter. The switching transients and their parasitic effects during a three-phase operation are assessed through an electromagnetic-circuit co-simulation model, by which the power loss and efficiency of the iHPM are estimated. The modeled parasitic inductance of the inverter is validated through inductance measurement, and the effectiveness of the simulated results in terms of switching transients and efficiency is verified using the experimental results of the double pulse test and open-loop inverter operation, respectively. In addition, the power loss and efficiency of the SiC MOSFET inverter are experimentally compared against those of a commercial Si IGBT inverter.

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