Characteristics of thermally induced acoustic emission from nanoporous silicon device under full digital operation

Abstract

Dependence on cation size of thermally induced capacitive effect of a nanoporous carbon Thermally induced capacitive effect of a nanoporous monel Appl. Phys. Lett. 91, 153102 (2007);

Micro liquid-based thermo-acoustic transmitter for emitting ultrasound in liquid medium

“…This can be explained that, due to the low thermal effusitivity, the absorbed heat of the substrate reduced, and thus, most of the Joule's heat generated from the metal heater was converted to ultrasound. This result is also in good agreement with the theory suggested by Shinoda et al before [6,7].…”

“…Moreover, the generated ultrasound amplitude increased along with the increase of the input power. In our experiment, the correlation between the input power and the generated ultrasound amplitude is relatively linear, which was also observed for the thermal-induced ultrasound emission in air before by Shinoda et al [6,7].…”

“…This method were reported to have many advantages, when used in air, such as resonance-free and flat frequency response [6][7][8]. In this method, a heater is immersed directly in the medium to heat up the medium material to cause mechanical vibration.…”

Solution for acoustic field of thermo-acoustic emission from arbitrary source

“…4(a)-4(f) at a frequency of 120 kHz and a radial distance of 60 mm from the centre of TA emitter with power input q 0 = 1 W/cm 2 . Moreover, by Fourier series expansion of applied heat flux and spectral decomposition and synthesis of sound, the acoustic pressure field of impulse-driven TA emitter 5,6,23 can also be depicted by virtue of Eq. (11).…”

Silicon Porosification: Approaches to PSi Parameters Control

“…The remarkable thermal isolation capabilities of PSi suggested several applications in the realization of on-chip thermal sensors (Lysenko et al 1998), radiation detectors , gas-sensing devices (Maccagnani et al 1998;Kaltsas and Nassiopoulou 1999), and the realization of ultrasonic emitters (Shinoda et al 1999;Koshida et al 2013 Similar values for thermal constants are encountered in the field of Si nanowires (Li et al 2003) produced in a variety of methods with reduced disorder with respect to electrochemically etched PSi. From a general point of view, nanostructuring is nowadays considered one of the most promising approaches to on-chip thermal isolation (Leadley et al 2014;Lucklum et al 2014a,b) even for employment at cryogenic temperatures (Valalaki and Nassiopoulou 2014).…”