Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

Sadeghinia, M.; Jansen, K.M.B.; Ernst, L.J.

doi:10.1016/j.ijadhadh.2011.10.007

Cited by 68 publications

(30 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[9,10]. The determination of the change in viscoelastic behaviour during cure is possible but much more challenging [11][12][13][14][15]. The need for consideration of the viscoelasticity during cure of epoxy FM-94 is also investigated in this paper.…”

Section: Introductionmentioning

confidence: 99%

Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

Abouhamzeh

Sinke

Jansen

et al. 2015

Composite Structures

Self Cite

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

Abouhamzeh

Sinke

Jansen

et al. 2015

Composite Structures

Self Cite

View full text Add to dashboard Cite

“…Compared to other process technologies such as film lamination, large area compression molding allows for precise dimensional control (mold thickness variation < 20 µm) [3]. Epoxy molding compounds (EMCs) are the most widely used molding materials for compression molding and their reliability is of crucial importance towards system functionality [4].…”

Section: Introductionmentioning

confidence: 99%

Investigation of warpage in wafer-level Molding: Measurements and FE analysis

Farrugia

Grech

Casha

et al. 2015

2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

View full text Add to dashboard Cite

Novel 3D packaging technologies which require largearea mold embedding are being developed in order to achieve further minimization and cost reductions. Compression molding using epoxy molding compounds is one technique being considered for wafer-level encapsulation. However significant warpage in molded wafers is a critical issue which may hinder successive processes from being carried out. Cases of both symmetric (spherical) and asymmetric (cylindrical)-shaped warpage have been reported in wafer-level compression molding trials on blank wafers. This paper presents finite element models of the molded wafer, with and without embedded dies, which take into account the observed complex multi-state warpage characteristics. Molded wafer warpage measurements were carried out in order verify the applicability of the small and large deformation theories for layered plates, to deduce the cure shrinkage molding compound properties and to validate the finite element model of the molded blank wafer. The latter was used to analyze possible factors (nonplanar mold layer thickness, anisotropic wafer elastic properties) leading to asymmetric warpage. The numerical model will thus enable the prediction of the optimum process and material conditions for the warpage to be minimized together with the expected deformation of the molded wafer model with embedded dies. Keywords-3D packaging; wafer-level molding; asymmetric warpage; bifurcation; epoxy molding compound 2015 Symposium on Design Test Integration and Packaging of MEMS and MOEMS 978-1-4799-8625-5/15/$31.00 ©2015 IEEE

show abstract

“…Same device was also used to study the epoxy moulding compound with and without fillers. 28 Holst et al 29 determined the volume chemical shrinkage of epoxy system containing fillers using a laser scanning dilatometer.…”

Section: Introductionmentioning

confidence: 99%

Effect of pressure and reinforcement type on the volume chemical shrinkage in thermoset resin and composite

Nawab

Boyard

Jaquemin

2013

Journal of Composite Materials

View full text Add to dashboard Cite

The diverse use of thermoset composite materials is increasing day by day in industrial applications. This has led to the development of several fabrication techniques, use of various reinforcement types, and different fabrication conditions to achieve a composite part with required properties. Despite all these technological advancements, there is a shear need to investigate and understand the effect of all these factors on the curing process. Volume chemical shrinkage of resin is one such property, which has been studied by several authors for a given value of applied pressure. A few studies have reported results on volume chemical shrinkage of composites for one type of reinforcement and for a single applied pressure. In the present work, experiments on vinylester resin and associated glass fibres composites were conducted under two different pressures. The tested composites were containing unidirectional fibres ([0] and [0/90]) and plain woven fabric with two different fibre volume fractions. The results of these experiments, carried out in a plunger type dilatometer, led us to show the effect of fibre fraction, type of reinforcement, and applied pressure on the volume chemical shrinkage of vinylester resin.

show abstract

Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

Cited by 68 publications

References 11 publications

Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

Kinetic and thermo-viscoelastic characterisation of the epoxy adhesive in GLARE

Investigation of warpage in wafer-level Molding: Measurements and FE analysis

Effect of pressure and reinforcement type on the volume chemical shrinkage in thermoset resin and composite

Contact Info

Product

Resources

About