2010
DOI: 10.1016/j.nima.2009.09.035
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Characterization and modelling of signal dynamics in 3D-DDTC detectors

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Cited by 4 publications
(8 citation statements)
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“…On the other hand, a much slower charge collection is predicted in the regions outside of this overlap, since electric fields are much weaker. An experimental confirmation of the simulations was done by shining laser pulses of different wavelengths onto the detector, allowing to control the depth of generation of the carriers [15].…”
Section: Overview Of 3d Simulationsmentioning
confidence: 99%
“…On the other hand, a much slower charge collection is predicted in the regions outside of this overlap, since electric fields are much weaker. An experimental confirmation of the simulations was done by shining laser pulses of different wavelengths onto the detector, allowing to control the depth of generation of the carriers [15].…”
Section: Overview Of 3d Simulationsmentioning
confidence: 99%
“…Nevertheless, the response time is low enough to avoid ballistic deficit problems when read-out with fast, LHC-like electronics. Further details can be found in [10]. …”
Section: B Diode Detectorsmentioning
confidence: 99%
“…As an additional feature, 3D technology is suitable for 10 manufacturing detectors with "active edge" [2], i.e., terminated with heavily doped trenches, where the 11 insensitive edge region can be reduced to a few µm, to be compared to a few hundreds of µm for 12 standard planar detectors. This option can facilitate the overall detector layout and reduce the material 13 budget, since no sensor overlap is needed within the same layer. 14 Full-3D detectors with active edges fabricated at the Stanford Nano Fabrication Facility (in the 15 following referred to as standard 3D detectors), are the state-of-the-art in this field and have already 16 proved to yield high good performance and high radiation tolerance.…”
Section: Introductionmentioning
confidence: 99%
“…This significantly delayed the fabrication, caused major yield problems, and also 11 limited the maximum etching depth achievable for the columns. When the DRIE equipment (Adixen 12 AMS200) became available at FBK, a fabrication recycle (3D-DTC-2B) could be processed entirely in 13 house and was completed in April 2009. Table 1 Test structures from the two batches have been extensively measured on wafer before proceeding 23 with functional tests.…”
mentioning
confidence: 99%
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