2011
DOI: 10.1117/12.879189
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Characterization and optimization of tin particle mitigation and EUV conversion efficiency in a laser produced plasma EUV light source

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Cited by 13 publications
(8 citation statements)
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“…Also, some neutral atoms can be guided and trapped by charge exchange with ions. 11) This system is also equipped with a chemical etching mechanism. With this etching mechanism the remaining Sn atoms are removed from the surface of the collector mirror and of some view ports.…”
Section: 1mentioning
confidence: 99%
“…Also, some neutral atoms can be guided and trapped by charge exchange with ions. 11) This system is also equipped with a chemical etching mechanism. With this etching mechanism the remaining Sn atoms are removed from the surface of the collector mirror and of some view ports.…”
Section: 1mentioning
confidence: 99%
“…Also, some neutral atoms can be guided and trapped by charge exchange with ions. 11) In reality, however, not all the Sn atoms and ions can be trapped in the magnetic field. Accordingly, our system is also equipped with a chemical etching mechanism.…”
Section: Droplet Generation and Magnetic Mitigation Technologymentioning
confidence: 99%
“…We have investigated EUV plasma generation scheme with the use of the small experimental tool operated at the repetition rate of 10 Hz (maximum). Figure 2 shows the experimental setup for the basic investigation of EUV light generation and Sn debris mitigation [5][6][7].…”
Section: Lpp Euv Light Source Equipment Configurationsmentioning
confidence: 99%
“…beam and/or a CO 2 laser (wavelength 10.6 µm) beam, the Sn droplet in the vessel is converted into a plasma emitting EUV where several states of Sn exist simultaneously [6,7]. Sn present during plasma generation is generally classified in three categories: fragments, neutral atoms, or ions.…”
Section: Double-pulse Laser Irradiation When a Sn Droplet Target Is mentioning
confidence: 99%