Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

Sepaintner, Felix; Scharl, Andreas; Rohrl, Franz Xaver; Bogner, Werner; Zorn, Stefan

doi:10.1109/tmtt.2020.2983934

Cited by 11 publications

(5 citation statements)

References 8 publications

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“…Concepts for micromachined transmission line structures were, as mentioned above, reported by several publications [4][5][6][7][8][9][10][11][12][13]. The main benefit of trenches in the isolation gaps between signal and ground traces in CPW transmission lines is the reduction of the effective permittivity DK e f f that is experienced by transmission lines, as only a part of their electromagnetic field is concentrated in the dielectric.…”

Section: Discussionmentioning

confidence: 99%

“…Advanced transmission line structures, also known as micromachined transmission line structures, can offer especially low losses and improved performance [4][5][6][7][8][9][10][11][12][13]. While most of the publications are dedicated to structures on silicon, some publications are available that deal with such structures on PCB substrates [6,8,10]. The main drawback of micromachined structures on PCBs is the sequential mechanical milling or laser milling process that is necessary to form the structures needed.…”

Section: Introductionmentioning

confidence: 99%

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Injection Compression Molding of LDS-MID for Millimeter Wave Applications

Wolf,

Werum,

Eberhardt

et al. 2023

JMMP

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LDS-MIDs (laser direct structured mechatronic integrated devices) are 3D (three-dimensional) circuit carriers that are used in many applications with a focus on antennas. However, thanks to the rising frequencies of HF (high-frequency) systems in 5G and radar applications up to the mmWave (millimeter wave) region, the requirements regarding the geometrical accuracy and minimal wall thicknesses for proper signal propagation in mmWave circuits became more strict. Additionally, interest in combining those with 3D microstructures like trenches or bumps for optimizing transmission lines and subsequent mounting processes is rising. The change from IM (injection molding) to ICM (injection compression molding) could offer a solution for improving the 3D geometries of LDS-MIDs. To enhance the scientific insight into this process variant, this paper reports on the manufacturing of LDS-MIDs for mmWave applications. Measurements of the warpage, homogeneity of local wall thicknesses, and replication accuracy of different trenches and bumps for mounting purposes are presented. Additionally, the effect of a change in the manufacturing process from IM to ICM regarding the dielectric properties of the used thermoplastics is reported as well as the influence of ICM on the properties of LDS metallization—in particular the metallization roughness and adhesion strength. This paper is then concluded by reporting on the HF performance of CPWs (coplanar waveguides) on LDS-MIDs in comparison to an HF-PCB.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Injection Compression Molding of LDS-MID for Millimeter Wave Applications

Wolf,

Werum,

Eberhardt

et al. 2023

JMMP

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“…Accordingly, combining the results of ( 11) and ( 12) and inserting them into (10), we have the general sensitivity equations of | S ij | with respect to Γ given by…”

Section: Motivation: Analyzing the Impact Of Impedance Variation On M...mentioning

confidence: 99%

“…However, it is more challenging to establish traceable standards with PCB technology, as most dielectric materials used in PCB manufacturing are composite materials made from reinforced fiberglass with epoxy resin. Millimeterwave (mm-wave) measurements performed on PCB are affected by uncertainties in the manufacturing process [9], [10]. Furthermore, dielectric materials based on fiberglass and epoxy resin can introduce a significant delay skew depending on the location of the transmission lines on the substrate [11], [12].…”

Section: Introductionmentioning

confidence: 99%

An Impedance Transition Method to Verify the Reference Impedance of Multiline TRL Calibration

Hatab¹,

Gadringer²,

Alterkawi³

et al. 2022

Preprint

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“…PCB manufacturing mostly uses composite materials made from reinforced fiberglass with epoxy resin, which can introduce significant delay skew depending on the location of the transmission lines on the substrate [10], [11]. Manufacturing : tolerances of PCBs are also much higher than those in onwafer applications [12], [13].…”

Section: Introductionmentioning

confidence: 99%

Validation of the Reference Impedance in Multiline Calibration With Stepped Impedance Standards

Hatab,

Gadringer,

Alterkawi

et al. 2023

IEEE Open J. Instrum. Meas.

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This paper presents a new technique for evaluating the consistency of the reference impedance in multiline thru-reflect-line (TRL) calibration. During the calibration process, it is assumed that all transmission line standards have the same characteristic impedance. However, these assumptions are prone to errors due to imperfections, which can affect the validity of the reference impedance after calibration. Our proposed method involves using multiple stepped impedance lines of different lengths to extract the broadband reflection coefficient of the impedance transition. This reflection coefficient can be used to validate the reference impedance experimentally without requiring fully defined standards. We demonstrate this method using multiline TRL based on microstrip structures on a printed circuit board (PCB) with an on-wafer probing setup.

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Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air

Cited by 11 publications

References 8 publications

Injection Compression Molding of LDS-MID for Millimeter Wave Applications

Injection Compression Molding of LDS-MID for Millimeter Wave Applications

An Impedance Transition Method to Verify the Reference Impedance of Multiline TRL Calibration

Validation of the Reference Impedance in Multiline Calibration With Stepped Impedance Standards

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