Characterization of 4 Million Micro-Bump Interconnections at 7.6- $\mu \text{m}$ Pitch for 3-D Stacked 16 Million Pixel Image Sensor

Takemoto, Y.; Takazawa, Naohiro; Tsukimura, Mitsuhiro; Saito, Haruhisa; Kondô, Torû; Kato, Hideki; Aoki, Jun; Suzuki, Shun; Gomi, Yuichi; Matsuda, Shôichi; Tadaki, Yoshitaka

doi:10.1109/tsm.2017.2726536

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Characterization of 4 Million Micro-Bump Interconnections at 7.6- $\mu \text{m}$ Pitch for 3-D Stacked 16 Million Pixel Image Sensor

Cited by 2 publications

References 12 publications

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