Characterization of a Jet Impingement Heat Sink for Power Electronics Cooling

Klinkhamer, C.; Abishek, S.; Iyer, K.L.V.; Balachandar, Ram; Barron, R. M.

doi:10.1016/j.tsep.2022.101408

Cited by 16 publications

(2 citation statements)

References 35 publications

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“…According to the study, maximum heat transfer occurs on the heat source for low fluid spraying intervals, but reducing spraying intervals causes a severe pressure drop. To design a cooling system that works effectively, it is advisable to take into account factors such as fluid spraying distances and pressure drop [21]. Hu et al worked on optimizing the thermal operation of a heat sink with PCMs of varying porosity in metal foam.…”

Section: Introductionmentioning

confidence: 99%

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

elmi,

Lavasani,

Dinarvand

et al. 2024

Preprint

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Keeping the operating temperature in the allowable range of the power module, under a very high heat flux, is of particular importance in the performance of the systems and their reliability. In this investigation, as a new approach, a new hybrid thermal heat sink consisting of phase change material with different arrangement and mass flow rates has been used for cooling an Insulatedgate bipolar transistor. As an innovation, to reduce the operating temperature of the power module at a heat flux of 100 W/cm2, the paraffin and Metal-based PCM have been applied in the water cooling chamber and simulated simultaneously. The finite volume method and piezo algorithm was used to solve the governing equations. Then, the effect of the flow rate and arrangement of PCMs on temperature variations of the power module has been examined in terms of time. The melting process of the PCM was numerically simulated by the enthalpy-porosity method in threedimensional computational domain. The results revealed that using the metal-based PCM compared to paraffin due to its high thermal conductivity increased the heat transfer rate. As a result, the operating temperature of the power module decreased. Also, metal-based PCM in 4 different arrangements (A,B,C,D) performs better than the conventional cooling system. Finally, it reduced the operating temperature of the power module. Based on the results obtained at flow rates of 0.0025, 0.00375, and 0.005 kg/s, arrangement Case D showed the best performance by reducing 3 °C compared to the pure working fluid in the power module.

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Section: Introductionmentioning

confidence: 99%

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

elmi,

Lavasani,

Dinarvand

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

“…While water cooling has proven effective in enhancing the power density of power electronic devices, its application to low-voltage SVG presents challenges due to the intricacies of design and associated reliability concerns. Specifically, the incorporation of an additional water pump becomes necessary, leading to elevated manufacturing and installation costs for low-pressure SVGs [11]. Consequently, forced air cooling emerges as the preferred method for heat dissipation in low-voltage SVG.…”

Section: Introductionmentioning

confidence: 99%

A High Power Density Low Voltage Static Var Generator Based on Wide Band Gap Semiconductor Devices

Chen,

Hong,

Zhang

et al. 2023

IEEE Access

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The conventional Static Var Generator (SVG) usually uses IGBT as the power device whose switching loss is high, and switching frequency is low, so the size of output filter and heat sink are large, which limits the improvement of its power density and efficiency. The switching frequency of SiC-MOSFET can be more than twice that of IGBT, and it can withstand higher junction temperature, so that the efficiency and power density of SVG devices can be further improved. This paper optimized the design of SVG from the perspectives of inverter topology, switching frequency, power device loss, device cost, filter, heat sink, etc., and proposed a 220V/50kVar SVG based on SiC-MOSFET discrete devices. It is two-level interleaved as the power topology, a single inductance filter as the filter, and its equivalent switching frequency could reach 100 kHz. The volume of the prototype built is 37L, 66% of the conventional IGBT-SVG product, and the power density is 1.35kVar/L, which is 1.62 times that of the conventional IGBT-SVG product. The peak efficiency of the prototype is as high as 99.03%, and the efficiency is up to 98.75% at full load.

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Thermal Performance Analysis of Twin Pulsating Turbulent Jets Impinging over Intermittently Moving Plate

Kumar,

Halder

2023

Arab J Sci Eng

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Characterization of a Jet Impingement Heat Sink for Power Electronics Cooling

Cited by 16 publications

References 35 publications

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

Thermal Management of Power Modules Based on the Hybrid Cooling System: Phase Change Material with Coolant Fluid

A High Power Density Low Voltage Static Var Generator Based on Wide Band Gap Semiconductor Devices

Thermal Performance Analysis of Twin Pulsating Turbulent Jets Impinging over Intermittently Moving Plate

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