2007
DOI: 10.1088/0960-1317/17/3/003
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Characterization of a microfluidic device fabricated using a photosensitive sheet

Abstract: We investigated the characteristics of microfluidic devices fabricated using photosensitive sheets adhered to substrates. We evaluated them in regard to practical criteria, namely chemical resistance, pressure sealing, electrical resistance and elution of ions. No samples exhibited peeling after postbaking when we investigated the adhesion characteristics by dicing. The sheet swelled dramatically on exposure to an alkaline solution. The microfluidic devices consisting of photosensitive sheet sandwiched by two … Show more

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Cited by 13 publications
(7 citation statements)
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“…6a) [124,125]. Ito et al characterized the chemical and electrical properties of such films and reported compatibility with pressures up to 0.6 MPa when the DFR microfluidic layer is sandwiched between two PMMA layers [126]. As a notable example for rapid prototyping using DFRs, Zhao et al introduced a process, ''do it yourself 3D microfluidic chips'', which is based on multilayer lamination of DFRs and patterning them by direct projection lithography using a commercially available digital projector [127].…”
Section: New Prototyping Techniques Providing a Paradigm Shift For Sementioning
confidence: 99%
“…6a) [124,125]. Ito et al characterized the chemical and electrical properties of such films and reported compatibility with pressures up to 0.6 MPa when the DFR microfluidic layer is sandwiched between two PMMA layers [126]. As a notable example for rapid prototyping using DFRs, Zhao et al introduced a process, ''do it yourself 3D microfluidic chips'', which is based on multilayer lamination of DFRs and patterning them by direct projection lithography using a commercially available digital projector [127].…”
Section: New Prototyping Techniques Providing a Paradigm Shift For Sementioning
confidence: 99%
“…SU-8), DFRs are solid and available as rolls with typical thicknesses of the foil ranging from 5 µm to 100 µm (thicker layers can be obtained by multiple deposition) and length of up to 100 m. DFRs are meant to be laminated while applying some heat, exposed, developed, and post-baked [28,29]. DFRs were previously employed in the fabrication of microfluidic systems [19,21,[30][31][32]; however, these studies did not address the challenges of chip singulation, contamination of closed microchannels, high-throughput surface cleaning and treatment, and compatibility with integration of reagents. The physical properties of the cover film are important for fabricating functional microchannels and for easy chip singulation; therefore, an ideal DFR cover material should (i) be rigid enough to tent over microchannels without collapsing, (ii) be sufficiently brittle to allow breaking, (iii) have good adhesion to the microfluidic substrate to prevent delamination and leaks, (iv) be amenable to patterning by cutting, punching, or photolithography, (v) not interfere with the wettability of microchannels, (vi) have good optical properties, and (vii) be compatible with the reagents for biosensing applications or chemically stable for chemical sensing applications.…”
Section: Dry-film Resists For Sealing Microfluidic Chipsmentioning
confidence: 99%
“…We evaluated the characteristics of microfluidic devices produced from a photosensitive sheet for practical purposes. 47 To obtain thicker sheets, the sheets can be easily stacked by lamination. Figure 16 shows a cross section of a Pyrex-Photosensitive sheets-Pyrex layered sample.…”
Section: ·5 Microfluidic Devicesmentioning
confidence: 99%