2005
DOI: 10.1109/tns.2005.856915
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Characterization of active pixel sensors in 0.25 /spl mu/m CMOS technology

Abstract: We are developing CMOS monolithic active pixel sensors for high energy physics applications. We have successfully produced three test structures. They feature several different pixel types including a Flexible APS (FAPS). The FAPS has a 10 deep pipeline in each pixel. This is specifically designed with the beam structure of the TESLA proposal for the Linear Collider in mind. Here results demonstrating that the standard active pixel devices are still operating well after a fluence of 10 14 p cm 2 will be report… Show more

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Cited by 17 publications
(9 citation statements)
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“…wafer showed minimal degradation in the overall performance of the sensor. 11 Tiling only four 10 cmϫ 12 cm detectors can provide an active area suitable for mammography ͑20 cm ϫ 24 cm͒. Such tiling of four detectors is a concern and would need to be carefully addressed.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…wafer showed minimal degradation in the overall performance of the sensor. 11 Tiling only four 10 cmϫ 12 cm detectors can provide an active area suitable for mammography ͑20 cm ϫ 24 cm͒. Such tiling of four detectors is a concern and would need to be carefully addressed.…”
Section: Discussionmentioning
confidence: 99%
“…Rad-hard sensors have already been presented. [9][10][11] Large sensors, up to wafer scale, can today be produced by using "stitching," a technique that is already mature and allows creation of seamless devices that are larger than the reticle used in CMOS process, i.e., about 2 cmϫ 2 cm. This can also be performed for a very small pixel size 12 ͑less than 10 m͒ and is able to produce a sensor with an active area up to 12 cmϫ 12 cm.…”
Section: Introductionmentioning
confidence: 99%
“…A much higher radiation tolerance was reported for a sensor built in a 0.25 µm CMOS process with an 8 µm epitaxial layer [65]. It hosted different kinds of 3T-pixels with 15 µm pitch and diodes of either 3 × 3 µm 2 or 1.2 × 1.2 µm 2 surface.…”
Section: Charge Collection Efficiency Gain and Noisementioning
confidence: 99%
“…The use of multiple diodes has repeatedly been considered as a mean to improve the charge collection performances of CPS. Therefore, the technology was implemented into various early sensor prototypes [1,39,65]. The obvious draw back of the approach consists in the additional leakage current and increased pixel capacitance, which can be considered to scale approximatively with the number of diodes connected in parallel.…”
Section: Pixels With Multiple Parallel Collection Diodesmentioning
confidence: 99%
“…A much higher radiation tolerance was reported for a sensor built in a 0.25 µm CMOS process with an 8 µm epitaxial layer [66]. It hosted dierent kinds of 3T-pixels with 15 µm pitch and diodes of either 3×3 µm 2 or 1.2×1.2 µm 2 surface.…”
Section: Charge Collection Eciency Gain and Noisementioning
confidence: 99%