Characterization of Cold Drawn Gold bonding Wire with EBSD

Micro-doping in ultrafine-grained gold bonding wires

“…5-26. For all three wires, the misorientation peaks at -5-10° and -40-60°, which agree well with literature data (Cho, 2002). The differences between the three wires are not obvious in this form of representation.…”

“…As more Ca is added, <100> texture starts to appear at the surface and the core of the wires. This type of texture, with major <111> and <100> distributed only at the center and surface of the wires was also observed by Cho et al (Cho, 2002). The black spots on the map correspond to those nonindexed points.…”

“…EBSD is more suited and more reliable to characterize localized texture of single wire strand (Cho, 2002;Wulff, 2002) and is used in this work.…”

“…Where 5y; stands for the amount of microscopic deformation shear stress on any one of the activated slip systems in a given grain, and 8s represents the macroscopic plastic deformation applied externally. For the same value of critical resolved shear stress, those grains with higher Taylor factor will bear a higher flow stress, in which the grains can be considered to be stronger (Cho, 2002). In this work, the average Taylor factors were calculated using the EBSD software.…”

“…In this work, the average Taylor factors were calculated using the EBSD software. The values are estimated with the standard 12 slip systems for FCC metals, assuming that the {111} <110> slip system is operative, loading direction is in the drawing direction and velocity gradient appropriate to uniaxial extension as (Wright, 1993): ( [5][6][7][8] It is known that <100> oriented grains have the lowest Taylor factor whereas the <111> oriented grains have the highest Taylor factor under tensile deformation (Cho, 2002), therefore it can be used as an indication of the proportion of grain orientation. In Fig.…”