Characterization of Copper Coating Electrodeposited on Stainless Steel Substrate

Isa, Nik Norziehana Che; Mohd, Yusairie; Zaki, Mohammad Hafizudden Mohd; Mohamad, Sharifah Aminah Syed

doi:10.20964/2017.07.58

Cited by 33 publications

(10 citation statements)

References 30 publications

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“…Prior to electrodeposition experiments, according to literature, [96] steel plates (width 10 mm, length 20 mm) were mechanically polished with increasingly fine SiC paper (P320, P1200, P2500). Subsequently, the steel substrate was ultrasonically cleaned in acetone for 15 minutes, followed by drying at 110 °C for 30 minutes.…”

Section: Methodsmentioning

confidence: 99%

Speciation of Copper(II)‐Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids

2020

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The application of ionic liquids for the dissolution of metal oxides is a promising field for the development of more energy‐ and resource‐efficient metallurgical processes. Using such solutions for the production of valuable chemicals or electrochemical metal deposition requires a detailed understanding of the chemical system and the factors influencing it. In the present work, several compounds are reported that crystallize after the dissolution of copper(II) oxide in the ionic liquid [Hbet][NTf2]. Dependent on the initial amount of chloride, the reaction temperature and the purity of the reagent, copper crystallizes in complexes with varying coordination geometries and ligands. Subsequently, the influence of these different complex species on electrochemical properties is shown. For the first time, copper is deposited from the ionic liquid [Hbet][NTf2], giving promising opportunities for more resource‐efficient copper plating. The copper coatings were analyzed by SEM and EDX measurements. Furthermore, a mechanism for the decomposition of [Hbet][NTf2] in the presence of chloride is suggested and supported by experimental evidence.

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Section: Methodsmentioning

confidence: 99%

Speciation of Copper(II)‐Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids

2020

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“…Figure 2 offers a comparison between the different nanostructures obtained: geometrical aggregates from baths without additives (Figure 2a), nanospheres from the DTAB bath (Figure 2b), hemispheres of nanowires from the DAT bath (Figure 2c), and shapeless aggregates under the influence of the PEG bath (Figure 2d). Morphology of the Cu-depositions obtained from the unadditivated bath (containing only copper sulphate and sulfuric acid) were already observed on electrodepositions using similar baths on copper supports [34]. These structures are commonly produced when the electrodeposition of copper films is under kinetic control [35], i.e., when the rate-limiting step of the electrodeposition is the reduction process on the surface of the electrode [36].…”

Section: Effect Of the Additives On Catalysts Morphologymentioning

confidence: 90%

Electrodeposited Copper Nanocatalysts for CO2 Electroreduction: Effect of Electrodeposition Conditions on Catalysts’ Morphology and Selectivity

et al. 2021

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Catalytic electroreduction of carbon dioxide represents a promising technology both to reduce CO2 emissions and to store electrical energy from discontinuous sources. In this work, electrochemical deposition of copper on to a gas-diffusion support was tested as a scalable and versatile nanosynthesis technique for the production of catalytic electrodes for CO2 electroreduction. The effect of deposition current density and additives (DAT, DTAB, PEG) on the catalysts’ structure was evaluated. The selectivity of the synthesized catalysts towards the production of CO was evaluated by analyzing the gaseous products obtained using the catalysts as cathodes in electroreduction tests. Catalyst morphology was deeply influenced by the deposition additives. Copper nanospheres, hemispherical microaggregates of nanowires, and shapeless structures were electrodeposited in the presence of dodecyltrimethylammonium bromide (DTAB), 3,5-diamino-1,2,4-triazole (DAT) and polyethylene glycol (PEG), respectively. The effect of the deposition current density on catalyst morphology was also observed and it was found to be additive-specific. DTAB nanostructured electrodes showed the highest selectivity towards CO production, probably attributable to a higher specific surface area. EDX and XPS analysis disclosed the presence of residual DAT and DTAB uniformly distributed onto the catalysts structure. No significant effects of electrodeposition current density and Cu(I)/Cu(II) ratio on the selectivity towards CO were found. In particular, DTAB and DAT electrodes yielded comparable selectivity, although they were characterized by the highest and lowest Cu(I)/Cu(II) ratio, respectively.

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“…Cyclic voltammetry and chronoamperometry methods revealed information on the nucleation and growth kinetics of the copper coatings on the stainless steel. The density of copper nuclei, particle size, and surface area is highly influenced by the deposition time [18]. Augustin et al investigated the effect of current density during copper electrodeposition on the aluminum metal substrate on microstructure, hardness, and wettability of the textured copper coatings for antimicrobial application.The formation of nanocrystals in copper coatings causes improvement in the scratch resistance and the surface microhardness (see Figure 8a-d) [100].…”

Section: Electrodeposition Techniquesmentioning

confidence: 99%

“…Grain refiners, hardeners, brighteners, buffering agents, and leveling agents are other additives. By varying the process parameters such as pH, current density, bath composition, bath temperature, and deposition time, properties of the coating namely, morphology, and surface area is highly influenced by the deposition time [18]. Augustin et al investigated the effect of current density during copper electrodeposition on the aluminum metal substrate on microstructure, hardness, and wettability of the textured copper coatings for antimicrobial application.The formation of nanocrystals in copper coatings causes improvement in the scratch resistance and the surface microhardness (see Figure 8a-d) [100].…”

Section: Electrodeposition Techniquesmentioning

confidence: 99%

“…Touch surfaces in hospitals made of copper are effective in preventing the growth and survival of microorganisms [15][16][17]. Copper is oxidized when exposed to dry air; however, this does not affect its antimicrobial properties, which make it suitable for prolonged exposures under those conditions [18]. Copper in its pure form can kill 99.9% of bacteria after an hour, but 60% pure Cu takes two hours for similar antimicrobial efficacy [19].…”

Section: Introductionmentioning

confidence: 99%

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Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review

Bharadishettar

Kuruveri

Panemangalore

2021

Metals

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Microbial contamination of medical devices and treatment rooms leads to several detrimental hospital and device-associated infections. Antimicrobial copper coatings are a new approach to control healthcare-associated infections (HAI’s). This review paper focuses on the efficient methods for depositing highly adherent copper-based antimicrobial coatings onto a variety of metal surfaces. Antimicrobial properties of the copper coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), and sputtering techniques are compared. The coating produced using different processes did not produce similar properties. Also, process parameters often could be varied for any given coating process to impart a change in structure, topography, wettability, hardness, surface roughness, and adhesion strength. In turn, all of them affect antimicrobial activity. Fundamental concepts of the coating process are described in detail by highlighting the influence of process parameters to increase antimicrobial activity. The strategies for developing antimicrobial surfaces could help in understanding the mechanism of killing the microbes.

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Characterization of Copper Coating Electrodeposited on Stainless Steel Substrate

Cited by 33 publications

References 30 publications

Speciation of Copper(II)‐Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids

Speciation of Copper(II)‐Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids

Electrodeposited Copper Nanocatalysts for CO2 Electroreduction: Effect of Electrodeposition Conditions on Catalysts’ Morphology and Selectivity

Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review

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