Characterization of copper oxidation and reduction using spectroscopic ellipsometry

Powell, R. A.; Settles, Derryck; Lane, Larry; Ygartua, Carlos L.; Srivatsa, Arun R.; Hayzelden, C.

doi:10.1117/12.410065

Cited by 4 publications

(3 citation statements)

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“…SE itself is widely adopted in the semiconductor and other industries for in-line thin film metrology process control (thickness and composition). The details of the method and the equations used can be derived from the Fresnel reflectivity formula [2]. Scatterometry CD measurements typically use an SE setup but the sample now is a periodical 3D structure that acts on the beam like a diffraction grating.…”

Section: Scatterometry Application To Dtm/bpm Disks and Templatesmentioning

confidence: 99%

Optical metrology for template and disk patterned imprints

2009

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Driven by the ever-growing storage density needs, the hard-disk drive (HDD) industry is transitioning to patterned magnetic media. For the first time, magnetic media disk production will require advanced lithography and critical dimension (CD) process control. The CDs of patterned media features will have to be smaller than the most advanced semiconductor design rules, and nano-imprint lithography (NIL) is the only candidate to yield such small dimensions at the low cost the industry demands. After an introduction to the industry's drivers for the transition, we give a summary of the NIL process for HDD media production, and an estimate of the CD metrology requirements for future process control. We then present some arguments and results to illustrate how a spectroscopic ellipsometry based scatterometry technique could be a good candidate to meet the CD control requirements of the patterned media roadmap. Simulations and experimental results on several DTM structures, for both template and disk imprints are discussed.

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Section: Scatterometry Application To Dtm/bpm Disks and Templatesmentioning

confidence: 99%

Optical metrology for template and disk patterned imprints

2009

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“…The (α+β) Brass alloys are functional in dissimilar fields of industry, weapons manufacturing, airplane manufacturing, engine construction, the manufacture of engine carriages. [1].…”

Section: Introductionmentioning

confidence: 99%

“…However, these alloys are suffering from oxidation problems especially at high-temperature applications and also suffering from zinc removal problems that accompanied with mechanical properties. The aluminum is one of the significant alloying elements that have a great role in the improving oxidation resistance of brass alloys at the high-temperature applications by forming a protective surface layer of (Al 2 O 3 ) [1].…”

Section: Introductionmentioning

confidence: 99%

Improving Oxidation Behavior of (Alpha- Beta) (Cu-Zn40) Brass by Aluminum Addition

Hallem¹,

Tjprc²

2019

IJMPERD

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Brass alloys with a zinc content of 35 % and more have a mixture of the alpha (FCC) and beta (BCC) phases, that causes an increasing in hardness significantly. Further, this alloy can be formed only by hot-working. Therefore, it appears problematic of oxidation at high temperature. This leads to create an idea of improving oxidation behavior of the α+β (Cu-Zn40) brass alloy by adding different amounts of aluminum(1, 3 and 5) wt %. Cyclic oxidation tests were conducted on the α+β (Cu-Zn40) brass with and without aluminum in the air at temperatures range between 500-700°C for 18 hours at 6 hours cycle. All specimens exhibited parabolic oxidation rate dependence and the value of K p for (α+ β) (Cu-Zn40) brass alloy with aluminum is nearly lower than that for(α+β) (Cu-Zn40) brass alloy under the same condition. The phases appear in the cyclic oxidation of α+β (Cu-Zn40) brass surface after addition of aluminum under further most test situations as exposed by XRD examination are (Al 2 O 3 , ZnO, CuO).

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