2018
DOI: 10.1016/j.mssp.2018.05.013
|View full text |Cite
|
Sign up to set email alerts
|

Characterization of crystalline GeSn layer on tensile-strained Ge buffer deposited by magnetron sputtering

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
10
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 18 publications
(10 citation statements)
references
References 30 publications
0
10
0
Order By: Relevance
“…76 Yuanhao Miao et al prepared tensile strain Ge buffer layer using an eight-wafer reduced pressure chemical vapor deposition system, followed by tensile-strained GeSn layer to reduce the chance of indirect transition and increase the direct one. 77 Z. Kong et al tried to increase the tensile strain and relax the compressive strain caused by the Sn content by surrounding the GeSn with an insulating stressor layer. They prepared the GeSn layer on the Ge/Si virtual substrate and capped it by Al 2 O 3 .…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…76 Yuanhao Miao et al prepared tensile strain Ge buffer layer using an eight-wafer reduced pressure chemical vapor deposition system, followed by tensile-strained GeSn layer to reduce the chance of indirect transition and increase the direct one. 77 Z. Kong et al tried to increase the tensile strain and relax the compressive strain caused by the Sn content by surrounding the GeSn with an insulating stressor layer. They prepared the GeSn layer on the Ge/Si virtual substrate and capped it by Al 2 O 3 .…”
Section: Introductionmentioning
confidence: 99%
“…77 Z.Kong et al tried to increase the tensile strain and relax the compressive strain caused by the Sn content by surrounding the GeSn with an insulating stressor layer. They prepared the GeSn layer on the Ge/Si virtual substrate and capped it by Al 2 O 3 .…”
mentioning
confidence: 99%
“…This approach is created due to the potential of Ge for optoelectronics applications, such as low-threshold Ge lasers [4,5], high-performance Ge photodetectors [6,7], high-performance Ge modulators [8,9], and Nanomaterials 2021, 11, 1421 2 of 13 high-mobility Ge electronic devices [10][11][12], etc. Furthermore, Ge buffer layers can also be regarded as a feasible platform for the growth of large lattice mismatch materials such as GaAs [13][14][15], InP [16,17], GeSn [18][19][20] on Si, which makes other novel optoelectronic devices on Si possible.…”
Section: Introductionmentioning
confidence: 99%
“…The smaller surface free energy of Sn compared to that of Ge makes Sn more likely to immigrate to the surface of the GeSn film during epitaxial growth and thermal treatment [7,8,9,10,11]. So far, several techniques such as chemical vapor deposition (CVD) [12,13,14], molecular beam epitaxy (MBE) [15,16,17], and magnetron sputtering [18,19,20,21,22] have been employed to achieve the crystalline GeSn layers.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, crystalline GeSn thin films with a high Sn content (28%) were also deposited on low-Sn-composition GeSn buffer layers using sputtering epitaxy [20]. Our previous work showed the deposition of GeSn on a tensile-strained Ge buffer with a low Sn content (3%), and the room temperature photoluminescence spectrum was observed [21]. However, no room temperature photoluminescence spectrum or GeSn-based diode were reported for a higher Sn composition GeSn alloy deposited by this method.…”
Section: Introductionmentioning
confidence: 99%