Characterization of dielectric barium titanate powders prepared by homogeneous precipitation chemical reaction for embedded capacitor applications

Three Techniques Used to Produce BaTiO<sub>3</sub> Fine Powder

“…Hwu [1], obtained cubic structure BaTiO 3 for (600˚C/6hr) calcination and tetragonal BaTiO 3 for (800˚C/6hr) calcination, and the crystalline size were (32.41 nm) and (41.32 nm) for (600˚C) and (800˚C) calcination respectively, So Hwu's results are similar to our obtainable result .…”

“…Barium Titanate is one of the most important ferroelectric materials which have many applications [1]. It belongs to a peroviskite structure as a ceramic so it needs to prepare BaTiO 3 ultrafine powder in order to reduce the calcination temperature, porosity, sintering temperature and sintering time [1].…”

“…It belongs to a peroviskite structure as a ceramic so it needs to prepare BaTiO 3 ultrafine powder in order to reduce the calcination temperature, porosity, sintering temperature and sintering time [1]. All above parameters will lead to reduce the cost through reducing the energy and increase efficiency.…”

“…The wide range of applications of BaTiO 3 includes preparing multi-layer ceramic capacitors (MLCCs), electro optical device, PTC and NTC resistors, piezoelectric actuators, transducers and chemical gas sensors. So that ultrafine powder is very necessary for these applications especially in (MLCCs) [1][2][3][4][5][6][7]. In this study, we try to discuss three chemical methods were used to prepare BaTiO 3 fine powder to conclude the best one according to the resultant phases, crystallite size, cost effective and time management.…”

Wet routes of high purity BaTiO3 nanopowders

“…Since the performance of BaTiO 3 ceramic significantly depends on the microstructure and sintered body, much attention has been focused on the control of powder synthesis. With the rapid developing of electronic industries, high purity nanopowders of BaTiO 3 with suitable size distribution and morphology are required greatly for manufacturing electronic devices such as multilayer chip capacitor, positive temperature coefficient resistance heater and sensors, embedded capacitance, and various boundary-layer capacitors [1][2][3].…”