Characterization of diffusion induced grain boundary migration in the Ag/Cu system

Guan, Zhuo-Ming; Liu, Guoxun; Du, Juan

doi:10.1016/0956-7151(93)90180-z

Cited by 12 publications

(9 citation statements)

References 22 publications

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“…When v λD gb B , the penetration depth of the solute atoms into the GB (characterized by y c ) will be small and vice versa. The concentration of B atoms may not be uniform in the z-direction either, but this cannot be analytically solved and the situation varies largely for different materials [276,287,288,289,290,291].…”

Section: A Grain Boundary As a Vacancy/self-interstitial Sinkmentioning

confidence: 99%

Grain-boundary kinetics: A unified approach

Han

Thomas

Srolovitz

2018

Progress in Materials Science

327

178

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Section: A Grain Boundary As a Vacancy/self-interstitial Sinkmentioning

confidence: 99%

Grain-boundary kinetics: A unified approach

Han

Thomas

Srolovitz

2018

Progress in Materials Science

327

178

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“…It can be inferred that in addition to volume and stationary grain boundary diffusion, there may be some other faster diffusion path available as the diffusion time is prolonged, i.e., diffusion along moving grain boundary, i.e., grain boundary induced diffusion itself (DIGM) is very likely. As the studies on DIGM in Zn/Fe [15] and Ag/Cu [16] systems showed, the diffusion coefficient in a moving boundary is two to three orders of magnitude larger than that along a stationary boundary. It has been also found in Ag/Cu [16] that the kinetics of the penetration of the DIGM zone is a linear function of time.…”

Section: Resultsmentioning

confidence: 97%

“…As the studies on DIGM in Zn/Fe [15] and Ag/Cu [16] systems showed, the diffusion coefficient in a moving boundary is two to three orders of magnitude larger than that along a stationary boundary. It has been also found in Ag/Cu [16] that the kinetics of the penetration of the DIGM zone is a linear function of time. In addition, it was reported that DIGM has occurred in phase formed by the interface reaction in 40Sn-Bi/Cu system [17].…”

Section: Resultsmentioning

confidence: 97%

Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state

Guan

Liu

2000

IEEE Trans. Adv. Packag.

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The characteristics of thickening kinetics of the intermetallic compounds (IMC) (Cu 6 Sn 5 + Cu 3 Sn) during aging at 120 C and 90 C in solid state were studied by quantitative metallographic analysis for three solder alloy systems: 40Sn-Bi/Cu, 40Sn-Bi-2Ag/Cu and Sn-37Pb/Cu. The diffusion couple were prepared by hot immersion in the molten solder bath. The results showed that the rate of the IMC thickening increases in the order Sn-37Pb/Cu 40Sn-Bi/2Ag/Cu 40Sn-Bi/Cu. The IMC thickening rate in the Sn-Bi eutectic system is one order of magnitude faster than that in Sn-Pb eutectic system. The time exponents are different from each other. The relationship between the increase of IMC and aging time follows a parabolic function in Sn-Pb system, and a linear relation in Sn-Bi system. Addition of Ag in Sn-Bi inhibits the IMC thickening process.

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“…However, composition change was not observed. After that many researchers have shown that at low temperature the composition change due to DIGM is much faster than due to the volume diffusion process [3][4][5]. Diffusion coefficient of solute in DIGM has been observed to be 8-10 orders of magnitude higher than that in volume diffusion process.…”

Section: Introductionmentioning

confidence: 95%

Effect of Zn concentration on diffusion induced grain boundary migration in Cu -Zn system

Pradhan

Gupta

Mondal

2009

Trans Indian Inst Met

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Cu-Zn alloy system with three different compositions has been chosen to study the time, temperature and composition dependence of the Diffusion Induced Grain boundary Migration (DIGM) in the temperature range of 277-427 o C. The grain boundary migration follows parabolic rate law as a function of time. The diffusivity, D b α, was calculated from concentration-distance profile using growth rate, v. The activation energy for diffusion is found to be 101kJ/mol which is nearly half of the activation energy required for volume diffusion indicating that preferential grain boundary diffusion is more favorable than volume diffusion leading to grain boundary migration in Cu-Zn system.

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Characterization of diffusion induced grain boundary migration in the Ag/Cu system

Cited by 12 publications

References 22 publications

Grain-boundary kinetics: A unified approach

Grain-boundary kinetics: A unified approach

Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state

Effect of Zn concentration on diffusion induced grain boundary migration in Cu -Zn system

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