Earth Resources and Environmental Remote Sensing/Gis Applications XIV 2023
DOI: 10.1117/12.2688737
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Characterization of interlayer bonding mechanism based on interface morphology between asphalt mix and electronics devices covers materials

Luis Gustavo Boada-Parra,
Freddy Apaza,
Federico Gulisano
et al.

Abstract: The electrification and digitalization of transportation is one of the most important challenges in achieving sector decarbonization, which is responsible for nearly one-fifth of greenhouse gas emissions in Europe. One of the issues related to road electrification is the adherence between pavement surfaces and embedded electronic devices (sensors, charging units, etc.). This study presents a methodology for evaluating the adherence between asphalt surfaces and electronic elements, characterizing the morphology… Show more

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